Webcast: Taking Sub-45nm Process Characterization to the Next Level

October 30, 2008 @ 12 p.m. Central

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Shrinking device geometries have made transmission electron microscopes (TEM) a necessity for developing and monitoring advanced semiconductor manufacturing processes. The ability to perform TEM imaging and analysis at the sub-nanometer scale is crucial to stay ahead of the curve.

As the proven technology leader, across the board, for nano- and atom-scale characterization, FEI is introducing innovative Connectivity Solutions to significantly reduce a lab's time-to-data. In this Webcast, FEI shows users how they can prepare, extract, transfer and load TEM samples in 75 minutes, instead of 2.25 days, through:

• Automated sample preparation from wafers
• Ex-situ sample extraction
• Secure, tweezer-less transfer and loading
• Ultra-high precision sample thinning
• Imaging and analysis using the world’s most powerful, commercially available electron microscope

Sign up for this Webcast now and find out how FEI Connectivity Solutions deliver the best analytical data in the fastest time, for process characterization at 45nm and below.

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Speakers:

Joseph Race Product Marketing Manager, TEM Systems FEI Company, Electronics Division

Joseph Race is the product-marketing manager for FEI's Transmission Electron Microscope (TEM) systems in the company's NanoElectronics semiconductor group. Race started with FEI in 2002 in their Beam Technology Division and has primarily worked with Focused Ion Beam (FIB) systems for circuit edit and device modification. Prior to joining FEI, he worked as an organic chemist at Oregon Analytical Laboratory and a microanalyst at Chemoptix.

Larry Dworkin Product Marketing Manager, Full-Wafer Dual Beams FEI Company, Electronics Division

Larry Dworkin is the product-marketing manger for FEI's full-wafer DualBeam systems in the company's NanoElectronics semiconductor group. Dworkin has worked on defect reduction and root-cause analysis in the semiconductor industry for more than 10 years. He has been with FEI since 2002 and holds a Master’s degree in physics from UCLA. Prior to joining FEI, he worked at Applied Materials as a senior process engineer.

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