WebcastsIn these webcasts, the content is developed and brought to you by key suppliers to the semiconductor industry and produced by Semiconductor International.
A New Dimension in Advanced Process Development: 3D Atom-Scale Analysis
December 11, 2008 @ 12 p.m. Central R&D labs depend on innovative imaging and analysis techniques to develop the manufacturing processes for future-generation semiconductor devices. Powerful microscopes like the FEI® Titan™ S/TEM offer stunning 2D images and analysis. more >> Posted: Oct 28, 2008 | Permalink
Taking Sub-45nm Process Characterization to the Next Level
October 30, 2008 @ 12 p.m. Central Shrinking device geometries have made transmission electron microscopes (TEM) a necessity for developing and monitoring advanced semiconductor manufacturing processes. The ability to perform TEM imaging and analysis at the sub-nanometer scale is crucial to stay ahead of the curve. more >> Posted: Sep 8, 2008 | Permalink
Intel's Journey With SAP Customer Relationship Management (SAP CRM)
Oct. 1, 2008 @ 12 p.m. Central Learn first-hand how Intel leveraged SAP CRM for greater agility to support business growth, while achieving 15%+ year-over-year cost savings. more >> Posted: Aug 27, 2008 | Permalink
XHR: SEM Like You've Never Seen Before
July 10, 2008 @ 12 p.m. Central Sign up now for this webcast and find out what it means to see SEM like you've never seen before. Advanced process development and process engineering groups have recently struggled to get the images and data they need from SEM platforms. But recent advancements in SEM technology have brought new levels of performance and flexibility not previously available to the lab. more >> Posted: May 21, 2008 | Permalink
Rewiring Chips with FIB Circuit Edit: Speed-Up Design Validation & Performance Optimization
Originally broadcast April 9, 2008 Today leading semiconductor companies employ focused ion beam (FIB) circuit editing to speed up design validation and performance optimization. FIBs can remove and deposit insulator and conductor materials to "re-wire" around flaws or to make circuit performance improvements. The material removal and deposition is done with high precision using an ion beam together with a variety of chemical gases. FIB circuit editing eliminates iterative cycles of prototype testing and mask modification. more >> Posted: Mar 4, 2008 | Permalink
Characterizing New Materials with Electron Microscopy
Originally broadcast December 4, 2007 Experts from FEI Company and the National Renewable Energy Laboratory (NREL) will discuss new analysis and characterization capabilities for novel materials and devices. Dr. Manuel Romero of NREL will present recent advances in scanning electron microscopy (SEM) that can be applied to state-of-the-art materials in the solar field, and Dr. Richard Young of FEI will discuss how you can maximize the analytical performance and flexibility of your SEM. more >> Posted: Oct 24, 2007 | Permalink
Go Beyond Optical Probing With SEM- and DualBeam™-Based Solutions to Find Non-Visible Defects at 90nm and Below
Originally broadcast November 13, 2007 When you're working at advanced geometries, you'll need tools and techniques that give you better resolution to find and analyze previously hidden failures. This seminar will show you how to combine in-situ probing techniques with scanning electron microscopy (SEM) or DualBeam tools to gain superior results at 90nm and below. more >> Posted: Oct 11, 2007 | Permalink
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