Webcast: Wafer Cleaning Solutions for 45 and 32 nm

April 15, 2008 7:04am CDT

Originally broadcast April 15, 2008

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Recorded as a live panel at Sematech's 2008 Surface Preparation and Cleaning Conference (SPCC) in Austin, Texas, the discussion will focus on front-end-of-line (FEOL) wafer cleaning and photoresist strip challenges and solutions for the 45 and 32 nm device generations. Industry experts present the real-world problems and solutions surrounding a plethora of new materials being used and considered, including related environmental issues.

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Moderator:

Aaron Hand Executive Editor, Electronic Media Semiconductor International

Panelists:

Jeffrey Butterbaugh Chairman, ITRS Front End Processes TWG Chief Technologist FSI International

Anthony Muscat Associate Professor, Department of Chemical & Environmental Engineering University of Arizona

D. Martin Knotter Senior Principal Scientist Contamination Expertise Center NXP Semiconductors

Brian Kirkpatrick Senior Member of Technical Staff Texas Instruments

Sponsor:

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Posted Apr 2, 2008