Semiconductor International - April 01, 2007
Cover Story
Wafer Cleaning and Surface Prep: Evolution to Revolution
More than 100 steps in a standard IC manufacturing process flow involve wafer cleaning or surface preparation, which include post-resist strip/ash residue removal, native oxide removal, and even selective etching. Although dry processes continue to evolve and offer unique advantages for some applications, most cleaning/surface prep processes are “wet,” involving the use of a...
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