Semiconductor International - December 01, 2006
Cover Story
Spectroscopic Ellipsometry Film Metrology Braces for 45 nm and Beyond
With the advent of new materials and structures at the 65 and 45 nm nodes, demands on thin-film metrology are increasing in complexity while metrology budgets get tighter. In several key processes, it is no longer sufficient to monitor just thickness and refractive index for process control. One must measure or infer composition, porosity and other parameters.
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