Semiconductor International - September 01, 2006
Cover Story
Deep Silicon Etching Gets Ready for 3-D ICs
Consumer products such as digital cameras, PDAs and cell phones, along with next-generation servers, are driving the need for product miniaturization: increased functionality, increased storage capacity or both in a smaller package.1 To meet this requirement, many device manufacturers are investigating 3-D interconnect technology to stack die or wafers.
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