Semiconductor International - November 01, 2005
Cover Story
New 3-D Chip Interconnect Technology
A new approach to 3-D chip stacking and interconnection has been developed by Ziptronix (Research Triangle Park, N.C.), and is capable of enabling over 4 million connections between bonded chips. The company is known for a room-temperature bonding process that results in covalent bonds between dielectrics.
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