Semiconductor International - March 01, 2005
Cover Story
Epitaxy Challenges for Strained Silicon in SOI Integration
Because of cost and technical limitations of the conventional feature size reduction approach, the search for alternative ways to enhance device performance has increased considerably during the past decade. New materials, new substrates and new device architectures are now prime and favored candidates to realize such improvements, and epitaxy is playing a key role as an enabling manufact...
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