Semiconductor International - March 01, 2004
Cover Story
Thermal Processing Tackles New Processes, Materials
Thermal processing is facing several challenges with regard to high-k and other materials, ultrashallow junctions, strained silicon and SOI, plus the eternal quest after shrinks to produce increasingly efficient and complex devices. While workarounds to avoid new material options continue, fundamental physical limits are being reached, which will force a reassessment of choices.
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