Semiconductor International - November 01, 2003
Cover Story
Wafer Bonding Enables New Technologies and Applications
Whether the bonding process is activated by temperature, a plasma or chemicals, the technology of wafer bonding is unifying different materials to create new devices and microcomponents that cannot be fabricated using silicon alone. Wafer bonding is fueling the silicon-on-insulator (SOI) revolution, but MEMS and MOEMS are not too far behind.
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