Semiconductor International - September 01, 2003
Cover Story
Designing Tracks for Better CD Control
To make possible high-yielding sub-130 nm patterning at 248 and 193 nm exposure wavelengths, DUV lithography must be able to produce uniform CDs with tight CD control across the wafer and wafer-to-wafer. The manufacturers of track systems have focused on optimizing the hot plates and post-exposure bake (PEB) processes, as well as the develop processes for enhanced CD control and uniformity.
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