Semiconductor International - August 01, 2003
Cover Story
Cleaning and Restoring k Value of Porous MSQ Films
Damage-free cleaning processes for low-k materials are critical to the minimization of the effective dielectric constant, keff, of interlevel dielectric stacks. During typical etching and ashing steps, hydrophobic porous MSQ is made hydrophilic, encouraging moisture uptake and increasing k value.
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