Semiconductor International - May 01, 2003
Cover Story
2003 Top Fabs
This year's Top Fab honor goes to two facilities. Intel's Fab 11X is the first manufacturing facility to provide high-volume 300 mm wafers using 130 nm process technologies including dual-damascene layers. SMIC Fab 1 is a foundry that rolled out 0.35-0.18 µm processes within a year-and-a-half of equipment move-in.
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