Semiconductor International - August 01, 2002
Cover Story
Better HF Etch Uniformity with Single-Tank Approach
Immersion processing, a tried-and-true method for wafer cleaning, has been redesigned from the ground up for 100 nm and future technology nodes, as stricter process tolerances are required. A new batch, single-tank process can achieve excellent uniformity in critical dilute HF (DHF) etches, and provide the uniformity of a dual-tank process in a single-tank footprint.
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