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Semiconductor International - July 01, 2001

Cover Story

Defect Inspection Enters Integration Era
"Defectivity has been viewed from a random standpoint. Now, shrinking process windows have driven a significant rise in systematic defect mechanisms," said Scott Ashkenaz, vice president of patterning and parametric process module control solutions at KLA-Tencor (San Jose). He added that at 0.13µm, and more so at 100 nm, these windows are tight.



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