SI CHINA     SI JAPAN
Login  |  Register          Free Newsletter Subscription
Subscribe

Semiconductor International - June 01, 2001

Cover Story

300 mm Overcomes Critical Hurdles
Although meeting most 300 mm requirements has involved straightforward scaling from lessons learned at 200 mm, the introduction of copper and exotic low-k materials demands the redesign of chambers, a search for possible alternatives to traditional CMP, and an unparalleled application of integrated metrology.



    FEATURES


    DEPARTMENTS


    TECH_NEWS




    Advertisement

    Advertisements





    ©2008 Reed Business Information, a division of Reed Elsevier Inc. All rights reserved.
    Use of this Web site is subject to its Terms of Use | Privacy Policy
    Please visit these other Reed Business sites