Semiconductor International - May 01, 2000
Cover Story
ECP Technology Faces Chemical, Dielectric Hurdles
Since IBM and its partners introduced it in 1997, ECP (electrochemical
plating) has become an enabling technology for copper applications. Then, it was
uncertain whether a void-free, high-aspect-ratio feature fill was possible.
Companies like Applied , Novellus , Semitool and Shipley developed different
chemistries, and now gap filling is yesterday's problem.
FEATURES
DEPARTMENTS
| TECH_NEWS
|
