Semiconductor International - December 01, 1999
Cover Story
Copper Moves CMP to Center Stage
IC design demands, the search for low-k materials, as well as the introduction of copper and noble metals, are turning CMP into a hub process in the fab. This also requires the development of exotic new chemistries, consumable sets, and even the introduction of technologies such as fixed abrasives.
Features Technology News
| DEPARTMENTS
|