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Podcasts: Lithography Technologies Share Infrastructure, Funding Woes

Michael Lercel, Sematech

Michael Lercel, Sematech

Lithography Technologies Share Infrastructure, Funding Woes

Recorded live at Sematech’s Litho Forum, this panel discusses the hurdles facing EUV, double patterning, high-index immersion, nanoimprint and e-beam maskless lithography technologies. As it turns out, they have much in common.






Posted: May 21, 2008  |   Listen Now | Download MP3 | Subscribe Now and never miss an episode  Subscribe Now and never miss an episode


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