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Focus on: Readers' Choice/Top 20 Articles 2008
January 2, 2009
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Dear Subscriber,
Over the past year, readers turned to stories and webcasts about trends in semiconductor manufacturing and markets, with photovoltaics muscling its way on the stage with one-fifth of the 20 most popular pieces. The 20 top stories of 2008 included several lithography-related articles and webcasts. The economy seemed to get worse as the year went along, nosediving in the fall, which accounted for attention paid to economic forecasts. Changes to the ITRS and trends in packaging/3-D interconnects also proved attractive to our readers in 2008. Check out the Top 20 below, or get the complete list of the Top 100 on Semiconductor.net:
www.semiconductor.net
David Lammers, News Editor
David.lammers@reedbusiness.com
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Photovoltaics: Grid Competitive in Five Years
Alexander E. Braun, Senior Editor — Semiconductor International, 1/29/2008
The solar photovoltaics industry will achieve grid parity -- standalone economic viability without incentives -- in under five years. This prediction was made by Stephen O'Rourke, senior analyst covering semiconductor capital equipment and materials for Deutsche Bank Securities (New York City), at this year's Industry Strategy Symposium (ISS 2008), presented by SEMI and held in Half Moon Bay, Calif. More
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IBM Takes Gloves Off for 32 nm Low-Power Competition With TSMC
David Lammers, News Editor -- Semiconductor International 6/26/2008
IBM engineers described the Fishkill alliance's low-power 32 nm process technology, which includes a high-k/metal gate stack, at the 2008 Symposium on VLSI Technology. IBM Vice President Gary Patton said the insertion of high-k will give the partners several advantages over foundry rival TSMC, which plans to stick with an oxide/poly gate stack. "Poly oxynitrides are going to be quite a bit more expensive than using high-k/metal gate at 32 nm," Patton said. More
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Perspectives From the Leading Edge: 3-D Discussions in the Valley...Continued
Philip Garrou, Consultant — Semiconductor International, 11/4/2007
At the RTI 3-D Architectures for Semiconductor Integration & Packaging meeting, Cadence Design CTO Ted Vucurevich indicated Cadence would be developing 3-D tool sets "once it is clear that the market is going this way." Vucurevich said memory will be one of the drivers for 3-D interconnects. More
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Roadmap Dictated by Flash, More Than Moore
Laura Peters, Lead Technical Editor -- Semiconductor International, 1/25/2008
The 2007 edition of the International Technology Roadmap for Semiconductors (ITRS) projects the technology targets needed to continue to produce semiconductor devices cost-effectively through the year 2022. A significant new focus is the emphasis on More than Moore, the integration of various types of devices, as is deemed cost-effective, either on the same chip or in the same package. More
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Chinese Company Begins Thin-Film Solar Cell Production
Yao Gang, Editor-in-Chief, SI China -- Semiconductor International, 1/14/2008
Nantong Qiangsheng Photovoltaic Technology Co. Ltd. (Shanghai) was scheduled to start production of thin-film solar cells in Nantong, Jiangsu, in January. The company planned to add two more production lines in 2008. More
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32 nm Marked by Litho, Transistor Changes
Laura Peters, Lead Technical Editor -- Semiconductor International, 1/1/2008
The transition from 45 to 32 nm is likely to involve some key material changes and a major change in lithography to double patterning for critical layers. Selections will be driven by costs and specific product needs. More
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2008 Economic Forecast: Fairly Unpredictable
Staff -- Semiconductor International, 1/1/2008
With the low average selling price of memory devices and reductions in capex plans, many forecasters are indicating a slower initial 2008, although the duration of a slowdown is hard to quantify. More
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Georgia Tech Report: China Now Rivals United States in Technology Competitiveness
Staff -- Semiconductor International, 1/24/2008
China has been rapidly improving its technology competitiveness, based on four factors measured over the past two decades by a research group at the Georgia Institute of Technology. "The future clearly doesn’t look good for the United States," concluded Nils Newman, co-author of the Georgia Tech report. More
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Flip-Chip Changes on the Horizon
Sally Cole Johnson, Contributing Editor -- Semiconductor International, 7/2/2008
Flip-chips haven't changed much since being invented by IBM in the early '60s, but some interesting trends are emerging and several potential changes are on the horizon. More
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Executive Outlook: Driving Productivity, CoO in 2008
Staff — Semiconductor International, 1/1/2008
Most analysts are expecting 2008 to be a good year for the semiconductor industry. It is a presidential election year in the United States and an Olympic year, both of which tend to spur global economic growth. On the other hand, the United States is still feeling the effects of the subprime mortgage crisis, rising oil costs and the fear of a possible recession in 2008. More
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Intel: 'EUV Facts Don't Add Up' for 22 nm in 2011
David Lammers, News Editor -- Semiconductor International, 4/22/2008
Intel has decided that extreme ultraviolet (EUV) lithography will not be production-worthy by 2011 when Intel plans to begin manufacturing 22 nm microprocessors, said Mark Bohr, director of process architecture and integration at Intel's logic technology development group (Hillsboro, Ore.). More
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Thin-Film Photovoltaics Capture More of the Spectrum
Aaron Hand, Executive Editor, Electronic Media -- Semiconductor International, 7/1/2008
Crystalline silicon (c-Si) technology -- comprising both multicrystalline and monocrystalline -- makes up some 90% of the PV market. But thin-film solar cells are on the rise for several reasons, not the least of which is a polysilicon shortage that has kept an already rapidly growing solar industry from realizing more of its potential. More
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Webcast: Highlights of the 2007 ITRS
Moderated by Laura Peters, Editor-in-Chief -- Semiconductor International, 1/22/2008
The revision to the International Technology Roadmap for Semiconductors (ITRS) included significant additions and other changes. Intel's Alan Allan, a member of the ITRS International Roadmap Committee (IRC) discussed the addition of "More than Moore" and other changes. Committee members discussed how the revised roadmap should be interpreted. More
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Webcast: Through-Silicon Vias: Ready for Prime Time?
Moderated by Laura Peters, Editor-in-Chief -- Semiconductor International, 3/25/2008
Three packaging experts discussed the various etch, deposition and plating processes required for fabricating TSVs, focusing on unsolved manufacturability challenges. The role of wafer thinning and carriers, as well as reliability, design and test issues, were discussed. More
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Physical Analysis Provides Images of 45 nm
Laura Peters, Editor-in-Chief -- Semiconductor International, 5/6/2008
Engineers at Chipworks Inc. have uncovered many physical details of the 65 and 45 nm process technologies, including the different ways that strain is being implemented and the complexities of high-k/metal gates. Dick James, senior technology analyst for Chipworks, provided an overview of two 45 nm chips: the Intel Xeon and Matsushita Electric Industrial Co. Ltd. UniPhier parts. More
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Yole Ranks Top 30 MEMS Suppliers; Sees Rapid Growth in Consumer, Medical
Staff -- Semiconductor International, 1/31/2008
Although automotive applications continue to fuel the MEMS market, the real driver for growth is coming from consumer applications, reported Yole Développement. Yole released its 2007 ranking of the "Top 30" MEMS manufacturers, with Hewlett Packard Corp. on top due to its inkjet printhead business. More
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Webcast: Preparing for High-Volume Immersion Lithography
Moderated by Aaron Hand, Executive Editor, Electronic Media -- Semiconductor International, 2/19/2008
Chipmakers are working to implement immersion lithography. Broadcast in both English and Japanese, this webcast features an international lineup of four lithography experts. More
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Haze, Still Misunderstood, Costing Industry $1B a Year
Aaron Hand, Executive Editor, Electronic Media -- Semiconductor International, 5/7/2008
Arguably the single largest yield detractor in the semiconductor industry, micro-contamination is still very little understood or acknowledged by semiconductor fabs. "Even though the semiconductor industry is a mature industry, it's really in its infancy in understanding micro-contamination," noted consultant Brian J. Grenon. More
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Photovoltaics Ready for Next Big Market
Alexander E. Braun, Senior Editor -- Semiconductor International, 2/20/2008
At SEMI's Silicon Valley Lunch Forum, panelists discussed: "Solar: Will It Light Up the Semiconductor Market? What are the Real Opportunities?" Mark Pinto, general manager of Applied Materials Energy and Environmental Solutions, said everything orbits around cost. More
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Fab Spending Tapers in 2008
Christian Gregor Dieseldorff, SEMI, San Jose -- Semiconductor International, 1/1/2008
Memory companies are fueling the increase in memory supply with even larger fabs, dubbed "megafabs." Many in the industry fear that this will accelerate a further decline in average selling prices (ASP). Concerns about oversupply are surfacing. More
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