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TOP STORY... January 8, 2009
IITC Set for Sapporo in June, Europe in 2011 The International Interconnect Technology Conference (IITC) will move from its traditional venue near the San Francisco airport to Sapporo, Japan, in early June. The conference will focus on 3-D technologies, packaging and system integration, novel materials and interconnect systems, and environmental issues, among others. Read more >>
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FEATURED BLOG...
The Measure of All Things: Of Sand and Power Senior Editor Alex Braun blogs on something rarely discussed in the debate over U.S. energy policy: the woeful and wasteful state of the power transmission grid. "The least expensive and painful way to conserve and reduce the demand on our current power sources," Braun writes, "is through a nationwide modernization of the power grid. This could increase the efficiency of the use and distribution of electric power by orders of magnitude, preparing the consumer to truly benefit from greener sources of energy."
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Survey of Wafer Fab Reticle Control Quality Strategies
Semiconductor manufacturing tools exhibit complex and quality that result in process tool malfunctions. This paper details a process - manufacturing excursion involving a wafer backside etch process that negatively impacted manufacturing on metal interconnect etch process toolsets. Download now!
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