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Semiconductor International NewsBreak
TOP STORY... January 6, 2009

Foundries Targeted at International Reliability Physics Symposium
Ensuring the reliability of chips made at foundries will be a major theme at this year's International Reliability Physics Symposium (IRPS), planned for April 26-30 in Montreal. The 2009 symposium will feature an invited speech from S.Y. Pai, director of reliability at Xilinx Inc. (San Jose). The conference also will take up high-k dielectric breakdown mechanisms, leakage in compound semiconductors, interconnect failure modes and electrostatic discharge (ESD) protection.
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MORE NEWS...

ASMI and SAFC Hitech Partner on Ultra High-k ALD

FEI Sees Another Strong Bookings Quarter

AXT Announces Revenue Decline in Preliminary Results

Kulicke & Soffa Announces Tender Offer for Notes

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Survey of Wafer Fab Reticle Control Quality Strategies

Semiconductor manufacturing tools exhibit complex and quality that result in process tool malfunctions. This paper details a process - manufacturing excursion involving a wafer backside etch process that negatively impacted manufacturing on metal interconnect etch process toolsets.
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FEATURED ARTICLE...

Bright New Phone Displays That Don't Guzzle Power
Anne Eisenberg reports on new types of power-saving displays in a New York Times article that features displays from Pixtronix and Qualcomm. Pixtronix uses energy-efficient LED bulbs that do not require energy-robbing backlighting, while Qualcomm has developed a reflective display that works fine in sunlight, Eisenberg writes.

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