SI NewsBreak 01/05/09 | Semiconductor International

Semiconductor International NewsBreak

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TOP STORY... January 5, 2009

Shin-Etsu Support Jig Handles Thin Wafers for Reflow Soldering

Shin-Etsu Polymer Co. Ltd. (Tokyo) has developed a support jig for handling thin (<50 μm) wafers that can endure 260°C in a solder reflow furnace during a wafer-level solder ball process. The thinned wafer is attached with a silicone rubber film and fixed with double resin rings. The ringed wafer is put on a thermoplastic substrate and conveyed into a reflow furnace as part of the process of making 3-D stacked chips.
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MORE NEWS...

Varian Revises Fiscal 1Q Estimates Slightly Downward

Solar Power Industry Remains Hot in California

Atmel Completes Sale of Heilbronn Fab

In Economic Slump, Some Japan Firms Investing for Recovery

Carbone Lorraine Acquires Calcarb in Solar Push

Sarnoff Awarded DoD Contract to Reverse Engineer Military ICs

MORE >>

Webcast: 2009 Semiconductor Industry Forecast
	In this recent webcast, leading analysts throughout the semiconductor and electronics industries provided their forecasts of the 2009 market, what factors will most impact capital spending by device manufacturers worldwide and how quickly economic turnaround might begin to materialize. View now! Sponsored by: SAP

FEATURED BLOG...

Perspectives From the Leading Edge: Fisk, Buckner and Pasta on the North End
Philip Garrou, who attended the Materials Research Society's annual Boston meeting, blogs on the 3-D related presentations there, including a spate of papers on various approaches to 3-D bonding from Ziptronix, CEA-Leti, RTI International and Tohoku University.

Interconnect Etch Tool Sensitivity to Wafer
	Reticle quality control in wafer fabs is different from quality control in mask shops. As such an industry-wide survey was undertaken to benchmark different strategies and approaches taken. This paper summarizes the results while retaining the different wafer fabs anonymity and confidentiality. Download now!

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