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IN THIS EDITION
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NEWS |
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EDITOR'S PICKS |
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PRODUCTS |
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UPCOMING EVENTS |
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Dear Subscriber,
Demand for wafer-level packaging (WLP) is increasing, and there are several very interesting emerging trends to watch in 2009 and beyond. In an exclusive interview with Advanced Semiconductor Engineering's Director of Engineering, John Hunt, and TechSearch Inc.'s President, Jan Vardaman, they describe the various trends to keep an eye on. You can read all about it in the first item in the Editor's Picks section. To keep up with all the latest packaging trends, bookmark our Semiconductor Packaging Technology Channel:
www.semiconductor.net/packaging
Sally Cole Johnson, Contributing Editor
scolejohnson@mac.com
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| Webcast: 2009 Semiconductor Industry Forecast |
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In this recent webcast, leading analysts throughout the semiconductor and electronics industries provided their forecasts of the 2009 market, what factors will most impact capital spending by device manufacturers worldwide and how quickly economic turnaround might begin to materialize.
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Sponsored by: SAP
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EVG and Brewer Science Enhance Thin Wafer Bonding Lab
PR Newswire, 1/7/2009
EV Group (EVG) and Brewer Science Inc. today announced the installation of an EVG 500 series wafer-bonding system at Brewer Science's Taiwan applications lab. Located in Hsinchu Science Park, this joint effort offers customers timely localized support in the Asia-Pacific region for 3-D IC and other advanced process development programs. More
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Kulicke & Soffa Announces Tender Offer for Notes
Business Wire, 1/6/2009
Kulicke & Soffa Industries Inc. announced that it has commenced a tender offer to repurchase for cash up to all of its $62M aggregate principal amount of its outstanding 1.0% Convertible Subordinated Notes Due 2010. More
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Aehr Test Systems Receives Order for Burn-in and Test System
PR Newswire, 1/6/2009
Aehr Test Systems has received a second order for the Advanced Burn-in and Test System (ABTS) from a leading European company. More
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Tessera Extends Licensing Agreement With Motorola
Business Wire, 1/5/2009
Tessera Technologies announced that Motorola Inc. has extended its patent licensing option agreement with Tessera. More
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ASE Reports Monthly and Quarterly Revenues
PR Newswire, 1/7/2009
Advanced Semiconductor Engineering Inc. (ASE) announced its unaudited consolidated net revenues for December and fourth quarter of 2008. More
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Sanyo Mulling Cut in Regular Workers in Semiconductor Operation
Jiji Press Ticker Service, 1/5/2009
Sanyo Semiconductor Co., a wholly owned unit of Sanyo Electric Co., is considering reducing regular employees probably through a voluntary early retirement program, sources said. More
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| Free Subscription to Semiconductor International |
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Semiconductor International is the leading technical publication covering the global semiconductor industry. It provides focus on the latest research projects, new technology developments and much more!
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Wafer-Level Packaging Trends Up in 2009
Sally Cole Johnson, Contributing Editor -- Semiconductor International, 1/7/2009
Wafer-level packaging trends include increasing demand, higher I/O, finer pitch, increased power for automotive applications and high-accuracy precision devices, said John Hunt, director of engineering at Advanced Semiconductor Engineering. Taiwan-based ASE is developing through-silicon via (TSV) capability, and fan-out packaging. ASE also has a licensing deal with Infineon in the field. More
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Shin-Etsu Support Jig Handles Thin Wafers for Reflow Soldering
Kenji Tsuda, Asia Contributing Editor -- Semiconductor International, 1/5/2009
Shin-Etsu Polymer Co. Ltd. has developed a jig for handling thin wafers that can endure 260°C in a solder reflow furnace. The tool makes it possible to use a silicone film to attach solder balls to thinned wafers for 3-D stacked chips. More
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| SIA Annual Semiconductor Industry Global Sales Forecast |
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SIA recently released its annual forecast for global semiconductor sales. Tune in to this on-demand webcast for a discussion and analysis of what may lie ahead for the global chip industry with SIA President George Scalise.
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Sponsored by: TSMC & Accenture
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Dicing Frame Prober
WDF 12DP is a 300 mm dicing frame prober designed to address the increasing demand for probing ultrathin and diced wafers. Tokyo Electron Ltd., Tokyo More
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Thermal Imager Upgrade
The latest version of the Micro thermal imaging system for semiconductor failure analysis includes a thermal imaging camera with 320 x 240 element uncooled detector and 0.05°C sensitivity, 20 micron microscopic lens, wide angle lens, and 16 bit digital Camera Link interface. OptoTherm Inc., Sewickley, Pa. More
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Subscribe to this daily e-newsletter to get the latest industry news and commentary for the global semiconductor industry, plus timely podcasts, webcasts, blogs and more. Each Friday, SI NewsBreak Special Reports dive deeper into a subject of great interest to the semiconductor industry.
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Tessera Technology Symposium
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2009 European Systems Packaging Workshop
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2009 Flexible Electronics & Displays Conference
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