 |
|
|
December 17, 2008 |
 |
|
|
|
|
IN THIS EDITION
|
|
|
|
NEWS |
|
| |
|
|
|
EDITOR'S PICKS |
|
| |
|
|
|
PRODUCTS |
|
| |
|
|
|
UPCOMING EVENTS |
|
|
|
|
| |
|
|
|
|
Dear Subscriber,
Lots of advanced packaging news this week -- ranging from ASAT's lastest earnings results to Rhom and Haas working with IBM on new packaging technologies. Another item definitely worth checking out is tucked away under the Events section -- a Semiconductor Packaging Symposium aimed at consumer applications. This is a hot topic, and the symposium, sponsored by the MicroElectronics Packaging and Test Engineering Council (MEPTEC), will be held on Thursday, February 19, 2009, in San Jose, Calif. You can find more details here, as well as get caught up with all the latest industry news. Wishing you a healthy, happy holiday season!
www.semiconductor.net/packaging
Sally Cole Johnson, Contributing Editor
scolejohnson@mac.com
|
|
|
Advertisement
|
| Webcast: 2009 Semiconductor Industry Forecast |
 |
In this Dec. 18 webcast, leading analysts throughout the semiconductor and electronics industries will provide their forecasts of the 2009 market, what factors will most impact capital spending by device manufacturers worldwide and how quickly economic turnaround might begin to materialize.
Register now!
Sponsored by: SAP
|
|
|
|
|
|
|
|
|
|
|
|
STATS ChipPAC to Lay Off 1600 in Latest Restructuring
Staff -- Semiconductor International, 12/17/200
STATS ChipPAC Ltd. (Singapore), which provides semiconductor test and advanced packaging services, has responded to the global semiconductor downturn with a restructuring plan that results in ~1600 employees being laid off, ~12% of the company's workforce. More
|
|
|
|
|
ASAT Prepares for Lower Sales in Fiscal 2Q09
Staff -- Semiconductor International, 12/17/2008
ASAT Holdings Ltd. (Hong Kong), which provides semiconductor package design, assembly and test services, today announced that revenue was up in the first quarter of fiscal 2009, but preliminary results show that numbers will be down again in the second fiscal quarter. More
|
|
|
|
|
Dalsa Semiconductor to License Alchimer's TSV Coating Technology
Staff -- Semiconductor International, 12/17/2008
Wafer foundry Dalsa Semiconductor has successfully created conformal copper seed layers on through-silicon via (TSV) structures using the eG ViaCoat process from Alchimer SA. As a result of the successful tests, Dalsa intends to license Alchimer's technology to enhance its MEMS production capabilities. More
|
|
|
|
|
Design House Joins SOI Industry Consortium
PR Newswire, 12/11/2008
The SOI Industry Consortium said Time To Market (TTM) Inc., an ASIC design and embedded software services company based in San Jose, has joined the group. More
|
|
|
|
|
Rohm and Haas to Develop Packaging Materials With IBM
Business Wire, 12/15/2008
Rohm and Haas Electronic Materials, a leading supplier of materials for semiconductor packaging, has entered into a joint development agreement with IBM to develop, as well as evaluate, new materials for emerging packaging technologies. More
|
|
|
|
|
Amkor to Settle Options Litigation for $11.25M
Business Wire, 12/11/2008
Amkor Technology, Inc. has entered into a memorandum of understanding with plaintiffs to settle the securities class action litigation filed against the company regarding stock options. More
|
|
|
|
|
iSuppli Predicts Equipment Spending to Reach Six-Year Low in 2009
M2 PressWIRE, 12/10/2008
Following a dismal 2008, global spending on semiconductor manufacturing equipment in 2009 will fall to its lowest level in six years, to $35.2 billion, down 17.6% from 2008, according to iSuppli Corp. More
|
|
|
|
|
Multitest to Merge with Everett Charles Technologies
Staff -- Semiconductor International, 12/12/2008
Multitest Elektronische Systeme GmbH, which makes test handlers and test sockets, said it will merge with the Semiconductor Test Group of Everett Charles Technologies. More
|
|
|
Advertisement
|
| Free Subscription to Semiconductor International |
 |
Semiconductor International is the leading technical publication covering the global semiconductor industry. It provides focus on the latest research projects, new technology developments and much more!
Subscribe Now!
|
|
|
|
|
|
|
|
|
|
|
|
|
Flow-Over-Wire Materials Enable Die Stacking
Michael Todd, Henkel Corp., Irvine, Calif. -- Semiconductor International, 12/1/2008
Recent advances in flow-over-wire (FOW) technologies, including FOW pastes and films, are enabling packaging engineers to design thinner packages, reduce manufacturing process steps and drive down overall package costs. More
|
|
|
|
|
Japan's 3-D R&D Consortium Takes Shape
Kenji Tsuda, Asia Contributing Editor - 12/08/2008
At SEMICON Japan, managers of the government-backed 3-D IC technology development project outlined the project's goals. Also at the show, managers from Accretech, Applied Materials and EV Group described their TSV-specific agendas, including new tools for 3-D interconnect applications. More
|
|
|
|
|
IEDM Panel: Processing Costs Headed Up
David Lammers, News Editor - 12/17/2008
With more expensive tools and new process modules coming, IC manufacturers will struggle to maintain the cost-per-function reductions that have broadened the market for semiconductors. The likely introduction of 3-D interconnects, vertical transistors and EUV lithography all will add pressure on wafer processing costs, experts said at an evening panel discussion at the International Electron Devices Meeting going on in San Francisco this week. More
|
|
|
Advertisement
|
| RSS Feeds – Bring The Headlines To You |
 |
Subscribe to SI's RSS Feeds to automatically receive the latest news headlines, technical features, blog postings, etc. as soon as they are posted. The power of RSS lies in its ability to bring all of the news and content that interests you into one place.
Subscribe now!
|
|
|
|
|
|
|
|
|
|
|
|
Jet Dispensing System
12/01/2008
The DispenseJet DJ-100 family of piezoelectric jets combines high production speed with high accuracy and process control. The series has three models: DJ-100 Standard, DJ-100 NC for low-viscosity materials, and DJ-100 GH for highly viscous fluids. More
|
|
|
|
|
Test & Burn-in Sockets
12/01/2008
High-frequency center probe and CSP/uBGA test and burn-in sockets are now offered in sizes up to 6.5 mm squared with pitches down to 0.3 mm. The reduced socket pitch meets the growing need to test smaller components while increasing reliability. More
|
|
|
Advertisement
|
| SIA Annual Semiconductor Industry Global Sales Forecast |
 |
SIA recently released its annual forecast for global semiconductor sales. Tune in to this on-demand webcast for a discussion and analysis of what may lie ahead for the global chip industry with SIA President George Scalise.
View now!
Sponsored by: TSMC & Accenture
|
|
|
|
|
|
|
|
|
|
|
|
Tessera Technology Symposium
|
|
2009 European Systems Packaging Workshop
|
|
Semiconductor Packaging -- Impacting the Age of the Consumer Electronics
|
|
|
|
|
Advertisement
 |
|
SUBSCRIBE
To activate a new FREE
e-mail subscription, visit
Click Here
CHANGE YOUR PROFILE
To change delivery
options, e-mail address or
register for other
newsletters, Click Here.
QUESTIONS?
If you have any questions
or need further assistance,
please contact our Online
Support Team.
Online Support Team
Reed Business Information
2000 Clearwater Drive
Oak Brook, IL 60523
Privacy Policy
** If you found this FREE
newsletter valuable, please
email it to a colleague!
To request your FREE
magazine subscription to
Semiconductor International, Click Here. |
|
|
|
|
