 |
|
|
November 19, 2008 |
 |
|
|
|
|
IN THIS EDITION
|
|
|
|
NEWS |
|
| |
|
|
|
EDITOR'S PICKS |
|
| |
|
|
|
PRODUCTS |
|
| |
|
|
|
UPCOMING EVENTS |
|
|
|
|
| |
|
|
|
|
Dear Subscriber,
Covering 3-D integration at a symposium and conference this week, Senior Editor Alexander Braun landed two articles under the "Editor's Picks," as must-reads. He provides details about the challenges facing 3-D integration (which include test, yield and design), and also describes the impact the current economic "uncertainty" is having on 3-D integration development. To keep up with more in 3-D integration and other packaging fronts, check back regularly at our Packaging Technology Channel:
www.semiconductor.net/packaging
Sally Cole Johnson, Contributing Editor
scolejohnson@mac.com
|
|
|
Advertisement
|
| ShinEtsu Resists – Perfect for 3D packaging, WLP, TSV and wafer bonding |
 |
For stress buffer, wafer bonding, copper pillar, RDL and 3D packaging. Low modulus, low temperature cure, low stress; g, h, or i-line sensitive, thick plating resists and dry films. Low dielectric constant; safe solvent; excellent prime-less adhesion.
View now!
|
|
|
|
|
|
|
|
|
|
|
|
Advanced Fine-Pitch Packaging Development at 65 nm in Singapore
Business Wire, 11/17/2008
Singapore's Institute of Microelectronics (IME) and Chartered Semiconductor Manufacturing have successfully optimized a range of fine-pitch packaging technologies for copper metallization and low-k dielectric silicon processes at 65 nm and below. The Chartered-IME collaboration has led to a greater understanding of chip-package interaction of low-k devices through modeling, simulations and reliability verifications on silicon. More
|
|
|
|
|
IMEC and Panasonic Sign Research Contract
Business Wire, 11/12/2008
IMEC and Panasonic signed a joint research contract covering most of the research domains of IMEC. More
|
|
|
|
|
SUSS MicroTec Introduces iVista Failure Analysis Tool
Business Wire, 11/11/2008
SUSS MicroTec Test Systems announced the iVista LC digital microscope capable of delivering high-resolution digital images in conjunction with laser-cutting capabilities. More
|
|
|
|
|
Semitool Full-Year Revenues Increase 11%
Marketwire, 11/11/2008
Semitool Inc. reported financial results for its fourth quarter and full fiscal year ended Sept. 30, 2008. Fourth quarter revenue increased 27% to $60.1M from $47.2M in last year's fourth quarter. More
|
|
|
|
|
Patent Award: Interposer Substrate
US Fed News, 11/14/2008
Researchers at Renesas Technology Corp. (Tokyo) have developed an interposer substrate manufacturing method that provides a "method for forming a narrow-pitch flip-chip bonding electrode and a wire bonding electrode at the same time so as to reduce cost of a substrate." More
|
|
|
|
|
Tessera Licenses Shellcase MVP Technology to Qtech
Business Wire, 11/11/2008
Tessera Technologies Inc. said Q Technology has licensed Tessera's image sensor packaging technology. More
|
|
|
|
|
Amkor Licenses FusionQuad Packaging Technology to ASAT
Business Wire, 11/7/2008
Amkor Technology Inc. said ASAT Holdings Ltd. has entered into an agreement to license Amkor's FusionQuad package technology. More
|
|
|
|
|
Tessera Signs Agreement With Motorola
Business Wire, 11/10/2008
Tessera Technologies Inc. announced that Motorola Inc. has signed an agreement with Tessera for an option to license Tessera's chip-scale packaging (CSP) technology. More
|
|
|
Advertisement
|
| Prototyping / R&D Bonder |
 |
The FINEPLACER® Lambda is a +/- 0.5 micron accuracy bonder capable of eutectic and Au/Sn soldering; thermo-compression /-sonic bonding; and adhesive technologies. The motorized model provides auto-touchdown and die placement, and controlled bonding after manual alignment of die to substrate. A manual version offers a 50x50 mm heating area with high ramp rate.
View now!
|
|
|
|
|
|
|
|
|
|
|
|
|
3-D Integration Development Threatened by Economic Uncertainty
Alexander E. Braun, Senior Editor -- Semiconductor International, 11/17/2008
As presenters and attendees prepared for the opening of this year's 3-D Architectures for Semiconductor Integration and Packaging conference, confidence in the technology's future was mixed with concern about survival in the current economy. More
|
|
|
|
|
3-D Integration Lacking in Design and Test Support
Alexander E. Braun, Senior Editor -- Semiconductor International, 11/18/2008
At a recent symposium on 3-D integration, leading expert Philip Garrou detailed the rise of the technology as well as the challenges facing it, including test, yield and design. More
|
|
|
Advertisement
|
| Free Subscription to Semiconductor International |
 |
Semiconductor International is the leading technical publication covering the global semiconductor industry. It provides focus on the latest research projects, new technology developments and much more!
Subscribe Now!
|
|
|
|
|
|
|
|
|
|
|
|
Electrostatic Voltage Sensor
Model 875 sensor is designed for in-line monitoring of electrostatic charge buildup in real time. The sensor features a measurement probe with automatic calibration technology, which enhances the utility of the sensor by maintaining high accuracy and speed, even as the distance between the non-contacting probe and the monitored surface changes. Trek Inc., Medina, N.Y. More
|
|
|
|
|
Planar Air-Bearing Motion Platform
The PlanarHD "high dynamic" air-bearing motion platform has been designed specifically to maximize throughput by providing up to 2 m/sec scan velocity and 2.5 g acceleration. The design uses a highly engineered mechanical structure that increases air-bearing stiffness and decreases moving mass. Aerotech Inc., Pittsburgh More
|
|
|
Advertisement
|
| RSS Feeds – Bring The Headlines To You |
 |
Subscribe to SI's RSS Feeds to automatically receive the latest news headlines, technical features, blog postings, etc. as soon as they are posted. The power of RSS lies in its ability to bring all of the news and content that interests you into one place.
Subscribe now!
|
|
|
|
|
|
|
|
|
|
|
|
Dec. 1-2, 2008: Ninth VLSI Packaging Workshop
|
|
Dec. 9-12, 2008: EPTC 2008
|
|
Dec. 10-12, 2008: Electrical Design of Advanced Packaging & Systems
|
|
|
|
|
Advertisement
 |
|
SUBSCRIBE
To activate a new FREE
e-mail subscription, visit
Click Here
CHANGE YOUR PROFILE
To change delivery
options, e-mail address or
register for other
newsletters, Click Here.
QUESTIONS?
If you have any questions
or need further assistance,
please contact our Online
Support Team.
Online Support Team
Reed Business Information
2000 Clearwater Drive
Oak Brook, IL 60523
You are receiving this
e-mail because you have
either requested a
newsletter or a magazine
from Reed Business
Information.
Privacy Policy
** If you found this FREE
newsletter valuable, please
email it to a colleague!
To request your FREE
magazine subscription to
Semiconductor International, Click Here. |
|
|
|
|
