 |
|
|
June 18, 2008 |
 |
|
|
|
|
IN THIS EDITION
|
|
|
|
NEWS |
|
| |
|
|
|
EDITOR'S PICKS |
|
| |
|
|
|
PRODUCTS |
|
| |
|
|
|
UPCOMING EVENTS |
|
|
|
|
| |
|
|
|
|
Dear Subscriber,
There's plenty of advanced packaging news to share this week — ranging from Big Blue's announcement about cooling 3-D chips with water to Entorian introducing a stacking alternative to dual-die packaging to new tool announcements, new R&D centers and licensing agreements. You can read all about it here and also find more advanced packaging news and events by visiting our Semiconductor Packaging Technology Channel:
www.semiconductor.net/packaging
Sally Cole Johnson, Contributing Editor
scolejohnson@mac.com
|
|
|
Advertisement
|
| The #1 Choice for Electrically Conductive Adhesives |
 |
Master Bond's line of electrically conductive adhesives is the Number One choice for tomorrow's advanced electrical circuitry. Nobody offers more solutions than Master Bond. Our product line includes silver, nickel, copper, and graphite-filled compounds. Both one and two-component systems are available. The cured products offer high physical strength, superior substrate adhesion, and uniform electrical conductivity. Long-term durability is excellent.
View now!
|
|
|
|
|
|
|
|
|
|
|
|
Aviza Develops Etch/PVD/CVD Tool for 3-D IC R&D
Sally Cole Johnson, Contributing Editor — Semiconductor International, 6/17/2008
Three primary factors are driving the adoption of 3-D ICs and associated packaging technologies: increased functionality, size shrinks and a lower cost. For through-silicon via (TSV) technology to be adopted in 3-D ICs, the cost has to be right — and there's a lot of research underway right now to try to drive it down below the $200 mark. More
|
|
|
|
|
ASE Packages One Billion Bluetooth Devices for CSR
Business Wire, 6/17/2008
Advanced Semiconductor Engineering Inc. (ASE) announced that it has provided CSR with the subcontractor assembly services that facilitated the shipment of its first one billion Bluetooth devices. CSR, a global provider of personal wireless technology, selected ASE for consistently providing the technology and manufacturing acumen critical to the successful manufacture of Bluetooth devices. More
|
|
|
|
|
Advantest Boosts Tested Multichip Packages per Hour
Kenji Tsuda, Asia Contributing Editor — Semiconductor International, 6/16/2008
Advantest Corp. (Tokyo) has developed two new memory testers designed for multichip package (MCP) memory applications: T5781 MCP tester and B2510 burn-in wafer tester for known good die (KGD). More
|
|
|
|
|
Unisem, FlipChip Sign Licensing Agreement for Wafer Bumping, WLP
Business Wire, 6/16/2008
Unisem and its subsidiary, Unisem-Advanpack Technologies Sdn Bhd (UAT), have entered into an agreement with FlipChip International LLC (FCI) for the licensing of FCI's wafer bumping and wafer-level packaging (WLP) technologies. As part of the agreement, UAT will license FCI's core technologies, including its premier Spheron technology. FCI will further solidify its investment in the partnership by becoming a shareholder of UAT. More
|
|
|
|
|
Entorian Introduces Stacking Alternative to Dual-Die Packaging
Business Wire, 6/13/2008
Entorian Technologies Inc. announced RC Stakpak, a new, low-cost package-on-package (PoP) stacking technology for DRAM memory. More
|
|
|
|
|
ASMPT to Build R&D Center in Chengdu Hi-Tech Zone
Asia Pulse, 6/10/2008
ASM Pacific Technology Ltd. (ASMPT) will set up an R&D center in Chengdu Hi-Tech Zone in Southwest China's Sichuan Province. The center will engage in R&D of core technologies for semiconductor packaging devices. More
|
|
|
|
|
IBM Cools 3-D Chips With Water
Market Wire, 6/4/2008
IBM Researchers, in collaboration with the Fraunhofer Institute in Berlin, demonstrated a prototype that integrates a cooling system into 3-D chips by piping water directly between each layer in the stack. More
|
|
|
|
|
MEMS Create 3-D Inspection Challenges
Jon Titus, Contributing Technical Editor — Test and Measurement World, 6/01/2008
Microphones, accelerometers, pressure sensors and many other products take advantage of MEMS. The diversity of MEMS devices presents vendors and users of inspection systems with a sizeable challenge: Unlike ICs that all look somewhat similar, each MEMS device has its own peculiarities and structures that require a unique inspection "recipe." More
|
|
|
Advertisement
|
| Ultra fast microfocus computed tomography (µCT) |
 |
YXLONs technology solutions pave the way for high volume µCT X-Ray:
-Scan time of 18 sec. and reconstruction in 2 minutes
-Innovative High Power Target for superb image quality and fast image acquisition
-High speed digital flat panel detector
-Dedicated reconstruction and visualization workstation
View now!
|
|
|
|
|
|
|
|
|
|
|
|
|
Electromigration-Induced Failures in Plastic Encapsulated IC Packages
William Eslinger, Boston Scientific, St. Paul, Minn. — Semiconductor International, 6/01/2008
A commercial CMOS digital potentiometer IC in an eight-pin small outline transistor package was demonstrating field failures after ~1 month of operation. Systematic failure analysis led to the identification of the failure mechanism: post-manufacture, metal migration inside the plastic-encapsulated package. Plated silver from the leadframe had dissolved and redeposited as metallic "stringers" along the interface boundary between the die attach epoxy and plastic encapsulate deep inside the package. More
|
|
|
|
|
NEC Shows Novel Thermal Monitor for SoCs at VLSI Symposium
Ron Wilson, Executive Editor — EDN, 6/17/2008
If your travel budget is like ours, the VLSI Symposium is taking place in Honolulu without you again this year. But the stream of interesting papers goes on, and we do our best to get a glimpse. One of the interesting spots is not a paper about mega-speed or nano-power, but about a chip management technique from NEC Corporate Labs. The company reported on an embeddable thermal sensor for use in dynamically controlling the operating temperature within functional blocks on an SoC. Blog
|
|
|
Advertisement
|
| Webcast: SIA Industry Forecast 2008-2011 |
 |
Tune in to this mid-year on demand webcast for the latest SIA forecast of global semiconductor sales through 2011. SIA President George Scalise offers comments and analysis of what may lie ahead for the global chip industry.
View now!
|
|
|
|
|
|
|
|
|
|
|
|
Dual-Mode Dry Etch Tool
PlasmalabµEtchEL is a flexible dry etch tool that offers switchable dual-mode PE/RIE capability on the company's PlasmalabµEtch200 and PlasmalabµEtch300 systems. The dual-mode configuration enables processes to be run for isotropic polyimide removal, isotropic SiNx removal and anisotropic IMD/ILD etch in a single tool for small die or packaged devices through to 200 mm wafers.
Oxford Instruments Plasma Technology Ltd., Bristol, UK
More
|
|
|
|
|
Epoxy Adhesives
Fast-curing conductive epoxy adhesives have been created. 124-34A/B-187 is a two-component, syringe-dispensable, isotropically, electrically conductive version. 125-01A/B-187 is the anisotropic version of this epoxy. Both feature high-quality thermal stability, chemical resistance and high-temperature properties.
Creative Materials Inc., Tyngsboro, Mass.
More
|
|
|
Advertisement
|
| Through-Silicon Vias: Ready for Prime Time? |
 |
In this on demand webcast, a panel of experts discuss the various etch, deposition and plating processes required for fabricating TSVs, focusing on unsolved manufacturability challenges. Panelists include: Philip Garrou of Microelectronic Consultants of NC, Jan Vardaman of TechSearch International, and Fred Roozeboom of NXP Semiconductors.
View now!
Sponsored by: ECI Technology, Surface Technology Systems & ALLVIA, Inc.
|
|
|
|
|
|
|
|
|
|
|
|
June 23-27, 2008: Nanomechanics for NEMS
|
|
June 24-28, 2008: PEAKS in Plating Symposium
|
|
July 14, 2008: Advanced Technology Workshop on Wire Bonding
|
|
July 15-17, 2008: SEMICON West
|
|
|
|
|
Advertisement
 |
|
SUBSCRIBE
To activate a new FREE
e-mail subscription, visit
Click Here
CHANGE YOUR PROFILE
To change delivery
options, e-mail address or
register for other
newsletters, Click Here.
QUESTIONS?
If you have any questions
or need further assistance,
please contact our Online
Support Team.
Online Support Team
Reed Business Information
2000 Clearwater Drive
Oak Brook, IL 60523
Fax: 630-288-8394
You are receiving this
e-mail because you have
either requested a
newsletter or a magazine
from Reed Business
Information.
Privacy Policy
** If you found this FREE
newsletter valuable, please
email it to a colleague!
To request your FREE
magazine subscription to
Semiconductor International, Click Here. |
|
|
|
|
