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Dear Subscriber,
There's been plenty of activity in the advanced packaging arena already this year, ranging from acquisitions to technology advancements to reaching volume milestones. We have several highlights for you here, but I'll also remind you to check in regularly for more developments at our Semiconductor Packaging Technology Channel:
www.semiconductor.net/packaging
Sally Cole Johnson, Contributing Editor
scolejohnson@mac.com
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| Thru-Silicon-Via (TSV) Foundry Services |
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ALLVIA, Inc. provides Thru-Silicon Via foundry services to MEMS and Semiconductor Industries meeting the demands of advanced vertical interconnects and System-in-Package (SiP) solutions. Through Silicon Vias provide the shortest electrical path between two sides of Silicon Die, allow miniaturization through 3D stacking, and support wafer level packaging (WLP) for RF and MEMS devices. With a full line of in-house processing equipment, ALLVIA offers services for prototyping as well as volume production runs.
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Tessera Licenses Optics Technologies to Nemotek
Business Wire, 1/16/2008
Tessera Technologies Inc. announced that it has licensed its OptiML wafer-level camera (WLC) technology and Shellcase wafer-level chip-scale packaging (WLCSP) solutions to Nemotek SA. More
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Microsemi to Acquire TSI Microelectronics
PrimeNewswire, 1/8/2008
Microsemi Corp. recently acquired the assets of TSI Microelectronics Corp., which was founded to make custom hybrids and other special products for defense and aerospace programs. Microsemi hopes to use TSI's advanced packaging substrate technologies to develop high-margin and high-ASP ICs, modules and subsystems for RF, microwave and millimeter-wave applications. More
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Renesas Technology to Expand Back-End Capacity
Business Wire, 1/11/2008
Renesas Technology Corp. plans to expand its back-end process plant in Malaysia to further strengthen the company's analog and discrete semiconductor business. In addition, Renesas has established a new analog and discrete semiconductor design company in Malaysia to increase its design resources. More
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Nextreme Announces New Thermoelectric Platform
Staff — Semiconductor International, 1/9/2008
Nextreme Thermal Solutions (Durham, N.C.) announced a version of its thin-film thermal bump technology optimized for cooling hot spots in laser diodes, LEDs and sensors. Unlike conventional solder bumps, Nextreme's bumps function as microscale solid-state heat pumps. The new thermoelectric module — called the Ultra-High Packing Fraction (UPF) OptoCooler module — is designed to control temperatures in optoelectronics, electronics, medical, military and aerospace applications. More
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| January 22: Highlights of the 2007 ITRS |
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In this webcast, Alan Allan, Intel External Programs Staff Engineer and member of the IRC, will explain the important changes relative to past years and significant additions to the roadmap. He will then be joined by the chairmen of several of the key technology working groups to answer live questions from the audience.
Register Now!
Sponsored by: TEL and Particle Measuring Systems
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Intel's Larrabee to Use Die Stacking, On-Chip Interconnect
Staff — Semiconductor International, 1/7/2008
Intel Corp. (Santa Clara, Calif.) will introduce die stacking in products targeting the graphics market, predicts market research firm In-Stat (Scottsdale, Ariz.) in a new report that analyzes Intel's new product lineup and product strategies. The report studies Intel's expansion into new market segments, including discrete graphics, consumer electronics and ultramobile devices (UMDs). More
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EV Group Wins Major Order From Flexible Display Maker
PR Newswire, 1/16/2008
EV Group (EVG) announced that it has received a multimillion-euro order from a leading European plastic electronics manufacturer for the high-volume production of flexible displays. More
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Tessera Shellcase WLP Available for 300 mm Wafers
Business Wire, 1/7/2008
Tessera's Shellcase wafer-level chip-scale packaging (WLCSP) technology is now available for packaging 300 mm wafers. The solution is aimed at image sensors used in next-generation mobile devices. More
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STATS ChipPAC Reaches Package-in-Package Volume Milestone
Market News Publishing, 1/8/2008
STATS ChipPAC Ltd. has achieved a milestone of over 25 million units manufactured for its package-in-package (PiP) solutions. More
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ASAT Holdings Announces Fiscal Q2 Financial Results
PR Newswire, 1/14/2008
ASAT Holdings Ltd. has announced financial results for the second quarter of fiscal 2008, ended Oct. 31, 2007. Net revenue in the second quarter of fiscal 2008 increased 6.6% to $40.2M, compared with net revenue of $37.7M in the previous quarter. More
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Advertisement
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| Is Your Product Among the Best of the Best? |
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Don't miss your chance to be recognized with a 2008 Editors' Choice Best Product Award! Enter your product in the 19th annual awards, judged by Semiconductor International's editors, with winners recognized in SI's July issue, as well as a ceremony at SEMICON West. Entry deadline is March 31, 2008.
Get more information and download the entry form today!
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One-Step Underfill
Underfill 688 is a non-odorous, low surface tension, reworkable, one component epoxy resin designed as a one-step underfill for flip-chip, chip-scale packages, ball grid array, etc.
AIM, Cranston, R.I.
More
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Wafer Bump Inspection System
IBIS-Versalea is a bump inspection system for silicon wafers. It uses conventional interferometry combined with massive parallel data processing to give a production scale inspection tool capable of inspection and reporting on 3000 bumps per second.
Lloyd Doyle Ltd., Surrey, UK
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Advertisement
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| 2008 Semiconductor Industry Forecast On Demand Webcast |
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This webcast brings together several key industry analysts to debate the semiconductor industry outlook for 2008 and give us their perspectives on application drivers, geographical influences, changes in the memory market and more.
View Now!
Sponsored by: SAP
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Jan. 22-24, 2008: Pan Pacific Microelectronics Symposium 2008
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Feb. 4-7, 2008: DesignCon 2008
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Feb. 11, 2008: Introduction to IC Packaging & Assembly
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