Dear Subscriber,
We've come out of lithography's busy show season with more updates on the progress being made toward achieving increasingly advanced technology nodes -- particularly in the areas of mask technologies and EUV. Our latest news is an update from Cymer on its EUV source, but we also have a wide range of news coming out of the recent Photomask and EUV conferences. Check out the updates below and, as usual, keep up with all the latest lithography advances at our Lithography Technology Channel:
www.semiconductor.net/lithography
Aaron Hand, Executive Editor, Electronic Media
ahand@reedbusiness.com
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Cymer Hitting Its EUV LPP Source Goals
David Lammers, News Editor -- Semiconductor International, 11/12/2008
Cymer said it is running its laser-produced plasma (LPP) EUV source for eight hours at a time at 50 W of pulsed power. By the end of the year, Cymer expects its source to generate 100 W of sustained power during the time of the exposure of the die, enough power for the pre-production EUV tools expected next year from the major scanner manufacturers, said David Myers, vice president of Cymer's EUV source program. More
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Brion and NuFlare Join Forces on Mask Technology
Business Wire, 11/5/2008
Brion Technologies and NuFlare Technology announced plans to apply their combined expertise in computational lithography and mask equipment technology. More
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IMEC Calls EUV Performance 'Impressive'
Laura Peters, Editor-in-Chief -- Semiconductor International, 10/23/2008
After only five months' experience with a new source on its Alpha Demo Tool (ADT), Kurt Ronse, director of the Advanced Lithography Program at IMEC (Leuven, Belgium), said he is impressed with the EUV tool's stability and performance to date. IMEC has demonstrated the ability to resolve 35 nm flash patterns with the scanner. More
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Photronics Shuts Down Manchester, UK, Mask Facility
Business Wire, 10/21/2008
Photronics Inc. announced its intention to streamline its operating infrastructure in Europe by ceasing the manufacture of photomasks at its facility in Manchester, UK. More
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ASML Presents Faster ArF Scanner, Says EUV on Track for 2010
Laura Peters, Editor-in-Chief -- Semiconductor International, 10/20/2008
ASML said it is on schedule for 2010 delivery of its first EUV production system. At a research review meeting in Veldhoven, ASML introduced a new positioning measurement system to improve overlay control by 50% to <2 nm for a Twinscan immersion system. More
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Mapper to Ship E-Beam Lithography System to TSMC
Staff -- Semiconductor International, 10/13/2008
Following closely on the heels of its announcement of a new CEO, Mapper Lithography (Delft, Netherlands) said it will ship its first 300 mm multi-column e-beam maskless lithography platform to TSMC for 22 nm process development and device prototyping. "Mapper's technology holds great promise for cost-effective manufacturing at 22 nm and beyond," said Jack Sun, vice president of R&D at TSMC. More
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Sematech Reports Resist and Mask Progress at EUVL Symposium
Business Wire, 10/14/2008
Sematech reported advances in moving forward the infrastructure that will prepare EUV lithography for cost-effective manufacturing, according to papers presented at the 2008 International EUVL Symposium in Lake Tahoe, Calif. More
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Kovio Demonstrates RFID Tags Using Printed Electronics
David Lammers, News Editor -- Semiconductor International, 10/16/2008
Kovio Inc. (Milpitas, Calif.) announced at EPC Connection 2008 that it is demonstrating RFID tags based on its printed ICs (PICs). The startup is getting ready to begin manufacturing at its Milpitas fab, using nine electronics-use inks that it developed internally. "Printed electronics is no longer a vision -- it is here," said CEO Amir Mashkoori. More
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Web Exclusive: Advancements in EUV Optics Technology
T. Miura and K. Murakami, Nikon Corp.; H. Magoon and A. Barada, Nikon Precision Inc.; M. McCallum, Nikon Precision Europe -- Semiconductor International, 11/1/2008
Extreme ultraviolet lithography (EUVL) is the most likely lithography solution at 22 nm half-pitch and beyond. The transition to EUVL presents significant challenges in the areas of projection and illumination optics, as well as contamination control, but marked improvements have been made in these areas. More
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Photomask Printability, Standards and Cleaning Remain Concerns
Alexander E. Braun, Senior Editor -- Semiconductor International, 10/10/2008
At the Photomask Technology conference in Monterey, Calif., technologists discussed ways to ensure the printability of patterns at the 22 nm node, and how to avoid damage to fragile features during cleaning. Ronald Dixson of NIST gave an update on NIST's program in photomask dimensional metrology, another concern at the 22 nm generation. More
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Views on News: When Is No Really a No?
David Lammers, News Editor -- Semiconductor International, 10/23/2008
Listening to the talk at this year's ISMI Symposium on Manufacturing Effectiveness, it's difficult to figure out what is going on in the 450 mm wafer development effort. One executive at a major IC maker said equipment executives are saying "No" in public but "Yes" in private about plans for 450 mm equipment development. Meanwhile, the technical investigation continues. A source at a lithography company said one question is whether the 450 mm wafers can be made flat enough. More
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Micronic Introduces Pattern Generator for Packaging Photomasks
Business Wire, 10/22/2008
Micronic Laser Systems AB introduced the FPS5300, a pattern generator for producing large-area photomasks needed in the expanding field of advanced packaging as well as other electronic applications.
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EV Group Ships 100th Nanoimprint Lithography System
PR Newswire, 10/13/2008
EV Group (EVG) announced it has shipped its 100th nanoimprint lithography (NIL) system. The milestone shipment is significant not only for EVG -- which holds 30% of the NIL market -- but also for the industry overall, as it serves to highlight the significant growth of the global NIL installed base, which has more than doubled over the past four years.
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Feb. 22-27, 2009: SPIE Advanced Lithography
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