Top Stories

Cost a Major Challenge for Advanced Packaging Solutions

Over the past several years, IDMs have seen the price of silicon fabrication fall, while the cost of packaging, assembly and test has steadily been on the rise. More

Current Issue

FEATURES

Semiconductor International June 2009 Cover

How CD-SEMs Complement Scatterometry

Emerging Trends in Advanced Packaging

Control Strategy for Wafer-Edge Defects

View Current Issue

FREE Subscription

Wafer-Level Packaging in Africa?
Yes, Africa. Nemotek Technologie is manufacturing wafer-level optics and packaging in its state-of-the-art facility located in Morocco's Rabat Technopolis Park.
Sematech Seeks EUV Mask Tool Funding
Few commercial suppliers are stepping up to develop the EUV mask inspection tools that will be needed for 22 nm EUV patterning, said Bryan Rice, director of lithography at Sematech. The consortium is organizing a meeting at SEMICON West of government, consortia and private industry leaders to develop financial support for the EUV mask infrastructure.
Sematech Crafts ZIL Solution for 16 nm
Sematech researchers said a zero interface layer (ZIL) approach has been demonstrated, and may be brought into chip manufacturing within the next few years. By eliminating the oxide interface layer between the high-k dielectric and the silicon channel, the EOT can be sharply improved, reducing short channel effects while improving the drive current.
Most Viewed Stories for Week of June 22, 2009
This week's top stories included two 3-D-related pieces: a story on the SUSS MicroTec wafer bonding partnership with 3M, and a blog on promising start-ups that presented at ECTC. Growth possibilities in the MEMS markets, Dainippon Screen's deal with Applied to make track vendor Sokudo a DNS subsidiary, and a look at how printed electronics technologies will impact display round out this week's most-viewed stories.
View All Stories

News from the Web

Altera's Embedded Systems Development Kit Accelerates the Creation of Cyclone III FPGA-Based Embedded Designs
Source: www.altera.com
Date: 20 hours 38 minutes 15 seconds ago.
Seamless Power Switcher And Battery Charger Solution Targets Portable Devices
Source: electronicdesign.com
Date: 07-04-2009 05:50:01 GMT
Parallel Execution of Visual Studio Team System Unit Tests
Source: www.chiplist.com
Date: 07-03-2009 00:07:52 GMT
DDR3 to Capture 30% of the Market by Year End - DRAMeXchange
Source: www.xbitlabs.com
Date: 07-02-2009 19:43:20 GMT
View All Stories

Free Business Purchase Quotes

Compare prices and features for auto dialer software.
Semiconductor International has partnered with BuyerZone to bring you free price quotes on hundreds of products, including auto dialer software and document management solutions.

Inspection, Measurement & Test

View All Stories

Featured Company

WL Gore & Associates

The company began in 1958, when Bill and Vieve Gore set out to explore opportunities for fluorocarbon polymers, especially polytetrafluoroethylene (PTFE). Within the first twelve years, Gore had wire and cables on the moon and operations... more

Most Recent Resources

News From Lexis Nexis

United Arab Emirates Wins International Renewable Energy Agency Headquarters

QuantaSol unveils 28.3% efficient single-junction solar cell; World record made public at UK's Royal Society Summer Science Exhibition

Trina Solar's Glass Supplier to Invest in Changzhou Trina PV Industrial Park

Blogs
Talkback
Podcast
Video

Perspectives From the Leading Edge

Philip Garrou, Consultant
July 02, 2009
ESI acquires XSil IP and Assets
Other information sources / blogs may be satisfied giving you headlines and...
More

The Measure of All Things

Alexander E. Braun, Senior Editor, Semiconductor International
June 30, 2009
Scatterometry on Steroids
It‘s always pleasant to report on ways that our industry often manages to...
More

Chipworks Inside Angle

Chipworks Inside Angle
June 11, 2009
Sandisk Uses Nine-Chip Stack in Latest microSD Card
Our Inside Angle is supposed to feature some of the remarkable things that we see...
More

Views on News

David Lammers, News Editor, Semiconductor International
May 18, 2009
Peering into Nanocrystal NAND
Freescale Semiconductor’s assertion that nanocrystal (NC) NOR flash will go...
More

View All Blogs

first 157 nm, then high-index...

guess who's next– 7/4/2009 12:54:59 PM CDT
in response to Sematech Seeks EUV Mask Tool Funding
What defect densities (or number of defects causing faults) do you expect on a...

Melvin Breuer– 7/3/2009 4:54:08 PM CDT
in response to Wafer-Level Packages Set Sights on Large Die
The memory makers are already using double patterning below 40 nm half-pitch....

memory maker– 7/1/2009 4:48:28 AM CDT
in response to Sematech Seeks EUV Mask Tool Funding
Continued EUV support is very poorly justified. To be frank, from what I have...

not liking what I see– 7/1/2009 1:39:49 AM CDT
in response to Sematech Seeks EUV Mask Tool Funding

» VIEW ALL TALKBACK THREADS

Photovoltaics on Track for Long-Term Role

Craig Hunter is vice president and general manager of the solar business at Intermolecular (San Jose), which specializes in combinatorial R&D. He previously worked at Applied Materials, where he led the company's entry into the thin-film solar business. In this interview, Hunter discusses the economic and technical future of PV.

Unique Nanotech College Opens New Horizons

Alain Kaloyeros, senior vice president and CEO for the University at Albany's College of Nanoscale Science and Engineering (CNSE), discusses his plans and hopes for the most advanced educational establishment of its kind, which houses the only fully integrated 300 mm wafer computer chip pilot prototyping and demonstration line.

»VIEW ALL PODCASTS