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  • Nikko Metals - Top Story

    Nikko Metals Offers Hybrid 450 mm Wafers


    Nikko Metals, a subsidiary of Nippon Mining and Metals, is readying hybrid 450 mm wafers that sinter a 300 mm single-crystal silicon wafer inside a 450 mm polycrystalline wafer. The goal is to save money for companies developing process equipment targeted to the 450 mm wafer diameter.

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  • SIA Industry Forecast Optimistic, but with Reservations

    The SIA's newest forecast predicts 2009 sales to reach $220B, down by 11.5% from 2008, but sees 2010 as topping $242B and 8.5% growth in 2011.

  • Quantum Dot Mapping Points to Unthought of Applications

    Quantum dots TS University of Michigan physicists have mapped quantum dots, crystals with wide-ranging applications in electronics and photovoltaics. The step may lead toward "designer dots" that can be tailored for specific applications, and demonstrates the usefulness of X-ray phasing techniques.
  • Jury Finds in TSMC's Favor in TSMC vs. SMIC Trade Secrets Trial

    TSMC vs. SMIC trial TS TSMC has won a nearly complete victory in the trade secrets trial ongoing in Oakland, Calif. After deliberating for several days, the 12-member jury delivered a verdict Tuesday morning, finding in TSMC's favor on the major issues. The damages phase of the trial begins Thursday and is expected to go to the jury early next week.
  • Sematech 3-D Program Provides Lessons

    Sematech 3-d TS Sematech's 3-D interconnect program has provided the equipment and materials industry with a proving ground over the last 18 months. Andy Rudack, a Sematech metrology engineer, noted that the bonded wafers exceed the SEMI standard for wafer thickness and weight, presenting a variety of readily solvable challenges.

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  • SIA President Talks About Industry’s Recovery, Future


    In this month's podcast, George Scalise, president of the Semiconductor Industry Association (SIA), talks about the semiconductor industry's prospects at the start of its recovery from one of the worst downturns in history, as well as the challenges it faces in global competition, regulation, and the introduction of new technologies.

    Hear It Now
  • The Coming of EUV Lithography – When?


    Senior Editor Alexander E. Braun interviews Toppan Photomasks CTO Franklin Kalk at the SPIE Photomask conference about the status of lithography in general and EUV lithography development in particular. Kalk believes considerable work and development still remain to be done for EUV to become a mainstream reality. Hear It Now
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