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Nikko Metals Offers Hybrid 450 mm Wafers

Nikko Metals, a subsidiary of Nippon Mining and Metals, is readying hybrid 450 mm wafers that sinter a 300 mm single-crystal silicon wafer inside a 450 mm polycrystalline wafer. The goal is to save money for companies developing process equipment targeted to the 450 mm wafer diameter.
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North American Engineering Student FPGA Competition Sign-Ups Open
Source: www.altera.com
Date: 11-05-2009 01:12:59 GMT
BMVIT Showcases The Austrian Nano Initiative
Source: www.azonano.com
Date: 11-07-2009 01:24:08 GMT
Analysts: TSMC still faces 40-nm problems
Source: www.eetimes.com
Date: 11-06-2009 21:54:00 GMT
Evergreen Moving Module Assembly To China
Source: www.solarindustrymag.com
Date: 11-06-2009 17:27:30 GMT
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SIA Industry Forecast Optimistic, but with Reservations

The SIA's newest forecast predicts 2009 sales to reach $220B, down by 11.5% from 2008, but sees 2010 as topping $242B and 8.5% growth in 2011.
Quantum Dot Mapping Points to Unthought of Applications
University of Michigan physicists have mapped quantum dots, crystals with wide-ranging applications in electronics and photovoltaics. The step may lead toward "designer dots" that can be tailored for specific applications, and demonstrates the usefulness of X-ray phasing techniques.
Jury Finds in TSMC's Favor in TSMC vs. SMIC Trade Secrets Trial
TSMC has won a nearly complete victory in the trade secrets trial ongoing in Oakland, Calif. After deliberating for several days, the 12-member jury delivered a verdict Tuesday morning, finding in TSMC's favor on the major issues. The damages phase of the trial begins Thursday and is expected to go to the jury early next week.
Sematech 3-D Program Provides Lessons
Sematech's 3-D interconnect program has provided the equipment and materials industry with a proving ground over the last 18 months. Andy Rudack, a Sematech metrology engineer, noted that the bonded wafers exceed the SEMI standard for wafer thickness and weight, presenting a variety of readily solvable challenges.
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Inspection, Measurement & Test

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Industry Research from In-Stat

Mobile Graphics & Multimedia Review

Integration Still Has Its Challenges Mobile electronics is the fastest...
DisplayPort 2009: The New VGA or the New DVI?

DisplayPort is a next-generation digital interface designed primarily for PCs and...
Mobile Processor Review

The Battle for the Next Generation Consumer Devices Mobile electronics is...
Interface Survey 2009: Tracking Interface Usage on Work and Home PCs

The market for digital interface technologies continues growing and includes USB,...

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Siemens

Siemens Water Technologies understands the critical quality and quantity issues of both the Semiconductor and Solar industries. Uptime is profit, downtime is loss. That is why major manufacturers in these industries trust their water treatment to... more
IEEE Xplore Digital Library

IEEE Xplore® Digital Library This article is provided by the IEEE Xplore Digital Library (www.ieee.org/ieeexplore), a powerful resource that provides you with instant online access to the latest research in your field. The most innovative... more

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Perspectives From the Leading Edge

Philip Garrou, Consultant
November 06, 2009
Taiwanese Focus on 3D IC
PFTLE recently covered 3D activities at ITRI [see PFTLE “3D IC at...
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Chipworks Inside Angle

Dick James, Senior Technology Analyst
November 05, 2009
Elpida Changes DRAM Capacitor Technology
As a break from the hyper-intensity of our Intel 32-nm analysis, I was scanning...
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Views on News

David Lammers, News Editor, Semiconductor International
August 03, 2009
Memory Takes from SEMICON West
Bob Johnson, the Gartner Inc. semiconductor manufacturing analyst, seems to enjoy...
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The Measure of All Things

Alexander E. Braun, Senior Editor, Semiconductor International
July 18, 2009
A Feast for Vultures
Vultures circled over SEMICON West. An unpleasant sight, because while our...
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3DIC is just a repackaging of mature technologies. What type of 3DIC products are...

guest– 11/7/2009 11:00:20 PM CST
in response to Taiwanese Focus on 3D IC
Intel's plans to apparently abandon silicon in 2017 seems like another issue that...

Tom Morrow– 11/2/2009 1:49:03 PM CST
in response to ISMI 450 mm Program Moving to Next Stage
Lisa- obviously famine because we have been starving for it for a few years now...

PFTLE– 10/31/2009 9:44:16 PM CDT
in response to The 4 Horsemen of 3D IC
The worst part of US business environment is environmental regulation. The...

D. Cowdrick– 10/30/2009 5:40:22 PM CDT
in response to U.S. Tax Code Penalizes Manufacturing

» VIEW ALL TALKBACK THREADS

SIA President Talks About Industry’s Recovery, Future

In this month's podcast, George Scalise, president of the Semiconductor Industry Association (SIA), talks about the semiconductor industry's prospects at the start of its recovery from one of the worst downturns in history, as well as the challenges it faces in global competition, regulation, and the introduction of new technologies.

The Coming of EUV Lithography – When?

Senior Editor Alexander E. Braun interviews Toppan Photomasks CTO Franklin Kalk at the SPIE Photomask conference about the status of lithography in general and EUV lithography development in particular. Kalk believes considerable work and development still remain to be done for EUV to become a mainstream reality.

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