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Group Opposing 450 mm N.Y. Subsidy
A "Concerned Citizen Group" is opposing any New York State funding for a 450 mm wafer development center at CNSE/Sematech in Albany, N.Y. The group told New York politicians that any state funding for 450 mm development would not benefit companies operating in the state, and would be a "reckless waste of taxpayer money." More
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Most Viewed Stories for Week of Feb. 1, 2010
The arrests in South Korea related to alleged theft of Samsung Electronics' know-how by Applied Materials Korea staff leads our Top 5 list this week. Yet to be determined if this was an inadvertent leak or a true conspiracy to profit from Samsung's techniques. Two blogs, one from Dick James on Apple's iPad and another by Phil Garrou on Samsung's 3-D roadmap, made the list. Stories on Cornell's crystal growth research, and a foundry ranking by IC Insights, also garnered reader attention.
Fan-Out Packaging Dispute Resolves in IP Licensing Deal
What began as a patent dispute over fan-out packaging technologies has resulted in an IP agreement that will ultimately make it easier for packaging subcontractors to license Epic's ChipsFirst and Freescale's RCP technologies in one step, said James Kohl, Epic's CEO.
Applied Korea at Center of IP Theft Case
South Korean prosecutors said Applied Materials Korea staff "extensively" gathered secret Samsung memory chip production technology and passed the intellectual property to Hynix Semiconductor. Seoul prosecutors arrested two, and booked 10 other Applied staffers without putting them in jail, according to reports in Korea. A Hynix executive and a Samsung employee also were arrested.
Crystal Growth Points to Defect-Free Thin Films
Cornell University researchers said colloidal research may lead to the discovery of principles that will enable the growth of defect-free thin films. The team led by Professor Itai Cohen tested conditions that lead to smooth crystal growth, and discovered that the random darting motion of the particles is a key factor affecting how crystals grow.
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On Copper Diffusion, Gettering and the Denuted Zone
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Yeah stop those evil 450mm Fabs. Then you can be like Pennsylvania where the last...
D. Cowdrick– 2/8/2010 10:53:54 PM CST
in response to Group Opposing 450 mm N.Y. SubsidyIf costs have doubled or more, margins will still be dropping. Even on the demand...
gd– 2/8/2010 8:01:22 PM CST
in response to 2010 Economic Forecast: How High the Jump?I believe that the group(s) opposed to the proposed 450 mm wafer processing plant...
kkazem– 2/8/2010 3:23:06 PM CST
in response to Group Opposing 450 mm N.Y. SubsidyNow here is an idea, how about giving these companies that are interested in...
Daryl– 2/8/2010 12:43:48 PM CST
in response to Group Opposing 450 mm N.Y. Subsidy
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Sematech’s New President Looks for Increased Collaboration
Daniel Armbrust has been appointed president and CEO of Sematech, succeeding Michael Polcari, who is now that industry organization's chairman of the board. In this month's podcast interview, Armbrust, who was most recently responsible for the operation of IBM's 300 mm fab in East Fishkill, N.Y., discusses his plans for Sematech, R&D funding, and the need for closer cooperation among semiconductor industry organizations.
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The Coming of EUV Lithography – When?
Senior Editor Alexander E. Braun interviews Toppan Photomasks CTO Franklin Kalk at the SPIE Photomask conference about the status of lithography in general and EUV lithography development in particular. Kalk believes considerable work and development still remain to be done for EUV to become a mainstream reality.
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Now Playing: TSMC Video - SIA Forecast Webcast
TSMC video from November 19, 2008 Semiconductor International webcast - SIA...
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February 21-25, 2010Location: San Jose Convention CenterSEMI-THERM
February 21-25, 2010Location: Hyatt Regency HotelLithoVision 2010
February 21-21, 2010Location: San Jose Civic Auditorium
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