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Monolithic Power Systems claims court win in Linear case
A Delaware court rules that Monolithic Power Systems has not breached a settlement and license agreement with Linear Technology. However, the company’s discontinued MP1543 product is found to have infringed Linear's patents.

BASF, Evonik to Develop Ceria-Based Slurries
BASF and specialty chemicals provider Evonik Industries AG will collaborate on the development of ceria-based CMP slurries, which are expected to come to market next year.

Nvidia Reports Thermal Issues Caused Packaging Failures
Nvidia Corp. said some of its notebook-use graphics chips have failed because of packaging materials that could not withstand the “extreme thermal environments” seen in notebook computers. The company will take a one-time charge of $150M-$200M during its second quarter.

Nvidia cuts estimate, expects up to $200M charge on product issue
Nvidia estimates revenue could shrink by 20% in its fiscal Q2 and says it will take a one-time charge up to $200 million on costs and expenses from a weak die/packaging material set in certain versions of its previous generation GPU and MCP products used in notebooks. The bad news sends Nvidia’s stock down more than 30% in afternoon trading.

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News from the Web

Picosun Package Gather Big Interest At ALD 2008 Conference
BASF and Evonik team on ceria-based CMP slurries
OBSAI adds LTE in to basestation standards
Source: www.eetimes.eu
Date: 15 hours 44 minutes ago
IC packaging and testing industry heads for single-digit growth in 3Q08

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Wafer Processing TSV Apps Need TSV Tools SMIC Lays Foundation for Shenzhen Fab IBM Takes Gloves Off for 32 nm Low-Power Competition With TSMC View All Stories	Lithography Austria Launches Nanoimprint Lithography Project Dow Corning Spins E-Beam Resist Applied Materials Looks at Life Beyond EUV View All Stories
Yield Management ATE Industry Maneuvers Around ‘Perfect Storm’ of Issues at 90 nm and Below Yield Goals for 22 nm Electromigration-Induced Failures in Plastic Encapsulated IC Packages View All Stories	Inspection, Measurement & Test Entangled Images Point to Better Quantum Data, Optical Measurements ATE Industry Maneuvers Around ‘Perfect Storm’ of Issues at 90 nm and Below VLSI Research Ranks Top Equipment Vendors View All Stories
Clean Processing Yield, Surface Prep for Nano Devices Novellus Offers Dry Strip Tools for High-Volume Memory, Advanced Logic Haze, Still Misunderstood, Costing Industry $1B a Year View All Stories	Materials IBM Takes Gloves Off for 32 nm Low-Power Competition With TSMC Samsung, Hynix to Cooperate on 450 mm Wafer Standards Sematech Reports Progress at VLSI Meeting View All Stories

News from Lexis Nexis

SEAJ Predicts 11.2% Decline for Equipment in Fiscal 2008

Agilent Acquires MTS Systems Nano Business

Intel Dedicates Fab 28 in Kiryat Gat

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THE FINE PRINT
Aaron Hand, Executive Editor, Semiconductor International
July 1, 2008
Who's Minding the Litho Store in Albany?
Molecular Imprints Inc. (Austin, Texas) put out a press release today announcing the ...
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SI'S TAKE ON SEMICON WEST
Laura Peters, Editor-in-Chief, Semiconductor International
June 30, 2008
SEMICON West '08: SEMICON/West Morphs Into A Different Show
SEMICON/West has been evolving into a slightly different show every year. In many way...
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PERSPECTIVES FROM THE LEADING EDGE
Philip Garrou, Consultant,
June 28, 2008
More 3D Integration at ECTC 2008
Replisaurus Update Before I update on recent presentations at the El...
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VIEWS ON NEWS
David Lammers, News Editor, Semiconductor International
June 27, 2008
IBM@45: eDRAM, Si! High-k, No
It now appears that IBM Corp. plans to implement a high-bandwidth silicon-on-insulato...
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I found this article very interesting. Way back in the 80''s we encountered a simil...
John D. Craig - 6/27/2008 12:18:22 PM PT
in response to Electromigration-Induced Failures in Plastic Encapsulated IC Packages

Many SEM pictures show crooked rough HSQ lines even at 40 nm. Philips and Delft Unive...
read - 6/27/2008 2:01:32 AM PT
in response to Dow Corning Spins E-beam Photoresist

Hello My name is T.S.Seshadri i am fresh from college and has joined a Semiconductor ...
T.S.Seshadri - 6/25/2008 7:47:34 PM PT
in response to The Evolving World of SECS/GEM

The spec at Dow Corning says minimum feature size of 6 nm, but this is a negative res...
skeptic - 6/25/2008 3:27:09 PM PT
in response to Dow Corning Spins E-beam Photoresist

» VIEW ALL TALKBACK THREADS

Processing and Material Challenges to Be Met Beyond 22 nm

Tom St. Dennis, senior vice president and general manager of Applied Materials’ Silicon Systems Group, talks about developments in logic, memory and materials during this time of More than Moore.

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Now Playing: CMOS and Beyond: Surface Prep at Nanoscales
At SEMICON West 2006, Alex Braun interviews Ahmed Busnaina, director of the NSF Nanoscale Science and Engineering Center for High-Rate Nanomanufacturing at Northeastern University. Busnaina gives his perspective on the longevity of CMOS, nanotechnology, and surface preparation at nanoscales.