RTI 3D Integration and Packaging Conference

When: 12/09/2009 - 12/11/2009

Location: Hyatt Regency San Francisco Airport Hotel Burlingame, Calif., United States of America

Industry leaders have been speaking at and attending RTI’s conference, 3-D Architectures for Semiconductor Integration and Packaging, since 2004 and have benefited from the unique opportunity offered by this conference to explore the technology and business implications of the trend toward 3-D integration and packaging. This conference series has helped define this new facet of the semiconductor industry. It offers a unique perspective of the techno-business aspects of this emerging commercial opportunity, combining technology with business, research developments with practical insights, to offer industry leaders the information needed to plan and move forward with confidence. This conference targets senior-level technologists, managers, and business executives from the world’s leading companies and research institutions, and offers attendees the opportunity to learn from the presentations given by invited industry leaders, from the ample networking opportunities during the conference, and from the expanded exhibit offerings of this year’s event.

Additional information:
Phone: 910.452.0006
Email: karen@teamycc.com
Website: http://techventure.rti.org