Topical Workshop on Wire Bonding

When: 07/13/2009

Location: San Francisco, Calif.

The objective of the Wire Bonding Workshop is to have a unique forum that brings together scientists, engineers, manufacturing, academia and business people from around the world who have been working in the area of wire bonding. The workshop has been specifically organized to allow for the presentation and debate of leading-edge technology and applications.

Additional information:
Website: http://www.imaps.org/wirebonding