Packaging Technology

When: 02/09/2009 - 02/10/2009

Location: Albuquerque, N.M.

Semiconductor and IC developments continue to proceed at an incredible pace. For example, today’s microprocessor chips have 1000× the processing power of those a decade ago. These challenges have been accomplished because of the IC industry’s ability to track Moore’s Law, which states that an IC’s processing power will double every two years. This has been accomplished by making devices smaller and smaller. The industry is also pushing to use semiconductor devices in an increasing array of applications. To accomplish this, the industry is also driving prices down. This has created a number of challenges related to the packaging of these components.

Semiconductor Packaging Technology is a two-day course that offers detailed instruction on the technology issues associated with today’s semiconductor packages. We place special emphasis on current package technology issues like lead-free solders, low-k dielectrics, and tools for package analysis. This course is for managers, engineers and technicians working in semiconductor packaging, using semiconductor components in high-performance applications or non-standard packaging configurations, or supplying packaging tools to the industry.

Additional information:
Website: http://www.semitracks.com/courses/packaging-tech-course.htm