2009 European Systems Packaging Workshop

When: 02/02/2009 - 02/04/2009

Location: Kinsale, Ireland

The IEEE Technical Committee on Systems Packaging (TC-SP) wishes to invite you to its 11th European Workshop. The goal is to view all types of packaged electronics from the macro perspective with emphasis on the overall technical system attributes, choices and challenges. This includes the product specifications, system architecture, technologies, electrical performance, power design and thermal management. The workshop approaches the product characteristics by focusing on all levels of packaging as the "glue" that holds the entire hardware system together. Consequently, designing the total package requires an intimate knowledge of all the technologies that go into the final product. This perspective leads to a broad knowledge of what's going on in all aspects of the worldwide electronics industry.

Additional information:
Website: http://www.ewh.ieee.org/soc/cpmt/tc14/Cork09/ESPW09.html