Ninth VLSI Packaging Workshop

When: 12/01/2008 - 12/02/2008

Location: Kyoto, Japan

The technical topics of this workshop will include:

System-in-a-package (SiP)MEMS packaging technologiesAdvanced fine-pitch packagingNanotechnologyWafer-level CSPMicro bumping technologyPackaging for optoelectronicsElectrical performance and thermal managementPackaging for automobileFailure mechanisms and reliability improvementRF components and modules/RF tagsMaterials for high-speed application and wafer processIntegrated passives/embedded componentsGreen materialLaminated materials and processingAssembly and packaging challenges for Cu/low-k chipsEmerging technologies

Additional information:
Website: http://vlsi-pkg-ws.org/vlsi-pkg.html