Date: Dec. 10-12, 2008

Location: Seoul, Korea

EDAPS 2008 will cover signal integrity topics, including high-speed digital signal integrity modeling, design and measurement; power distribution network; system-in-package (SiP)/system-on-package (SoP) design; high-performance packaging for system-on-chip (SoC); RF/microwave packaging for wireless communication and mobile phone; interconnect modeling, simulation and measurement; embedded passives modeling and measurement; high-speed channels modeling and measurement; EMI/EMC and electromagnetic modeling and measurement; and EDA tools for chip, package and board co-design and simulation.

www.edaps2008.org