Ninth VLSI Packaging Workshop
Date: Dec. 1-2, 2008
Location: Kyoto, Japan
The technical topics of this workshop will include:
- System-in-a-package (SiP)
- MEMS packaging technologies
- Advanced fine-pitch packaging
- Nanotechnology
- Wafer-level CSP
- Micro bumping technology
- Packaging for optoelectronics
- Electrical performance and thermal management
- Packaging for automobile
- Failure mechanisms and reliability improvement
- RF components and modules/RF tags
- Materials for high-speed application and wafer process
- Integrated passives/embedded components
- Green material
- Laminated materials and processing
- Assembly and packaging challenges for Cu/low-k chips
- Emerging technologies
vlsi-pkg-ws.org/vlsi-pkg.html
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