International Wafer-Level Packaging Conference
Date: Oct. 13-16, 2008
Location: Wyndham Hotel, San Jose, Calif.
The annual IWLPC explores cutting-edge topics in wafer-level packaging and IC/MEMS/MOEMS packaging, including 3-D/stacked/CSP/SiP/SoP and mixed-technology packages.
www.iwlpc.com
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