Date: Aug. 3-4, 2008

Location: Renaissance Tel Aviv Hotel, Israel

Semiconductor Packaging Technology is a two-day course that offers detailed instruction on the technology issues associated with today’s semiconductor packages. We place special emphasis on current package technology issues like polymers, lead-free solders, low-k dielectrics, and tools for package analysis. This course is for managers, engineers and technicians working in semiconductor packaging, using semiconductor components in high-performance applications or non-standard packaging configurations, or supplying packaging tools to the industry. Participants learn basic but powerful aspects about the semiconductor packaging. This skill-building series is divided into five areas:

1. Packaging Technology Overview
2. Current Issues
3. Materials for Packaging
4. Package Reliability and Characterization Techniques
5. Future Semiconductor Packages

www.semitracks.com/courses/packaging-tech-course.htm