Packaging Design
Date: Aug. 5-7, 2008
Location: Tel Aviv, Israel
Semiconductor Packaging Design is a three-day course that offers detailed instruction on the design and modeling of semiconductor packages. We place special emphasis on package interactions with the die. This course is a must for every manager, engineer and technician working in semiconductor packaging, using semiconductor components in high-performance applications or non-standard packaging configurations, or supplying packaging tools to the industry. Participants learn basic but powerful aspects about the semiconductor packaging. This skill-building series is divided into four segments:
- Packaging Design Overview
- Mechanical Simulations
- Thermal Simulations
- Modeling Semiconductor Packages
www.semitracks.com/courses/packaging-design-course.htm
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