Date: May 21–22, 2008

Location: Atlanta

Hosted by the Georgia Institute of Technology, the event will provide information on the latest trends in interconnection technologies used in electronic products. Members of JIC and technology leaders from industry will speak on environment-friendly manufacturing, 3-D integration, interposer substrates, and standards activities.

Attendees will gain a comprehensive view of both integrated electronics development and manufacturing, in addition to valuable insight on interconnect technologies that will impact the electronics industry over the next 10 years. Seven sessions, moderated by industry’s leading experts in interconnection technologies, will comprise the two-day event. Session topics include an overview of the major areas of the total package solution; the total package solution by Jisso level; reliability and quality; thermal management solutions; energy conservation and generation; nano materials; printed and embedded electronics; and SiP, TSVs and 3-D packaging.

www.ipc.org/JF0508