Date: May 14, 2008

Location: Dallas

This roadshow will provide a comprehensive overview of new developments in the field of through-silicon via (TSV) etching and filling, high aspect-ratio lithography, temporary bonding and materials associated with these technologies. Speakers from leading-edge corporations and institutes will provide a user’s point of view on critical topics for this revolutionary technology.

The seminars are technical in nature and should be attended by R&D and production managers, process engineers, and all that are interested in the technical aspects of these groundbreaking technologies.

www.3dintegration.org/usa