SI CHINA     SI JAPAN
Login  |  Register          Free Newsletter Subscription
Subscribe

2008 KGD Packaging & Test Workshop

Date: Sept. 7-10, 2008

Location: Embassy Suites, Napa, Calif.

The focus for the 2008 workshop is on power electronics. We are currently faced with unprecedented challenges and opportunities in the areas of power engineering, energy efficiency and resource management. Power electronics modules are the solution for challenges in these areas and will be crucial to the industry as we embark on the 21st century. The committee is also seeking presentations that will provide details of emerging technologies for reliability screens, handling, die delivery and packaging die products for use in today's ultraminiature, high-functionality electronic systems. The deadline for submission of proposals is May 23, 2008.

www.napakgd.com

Other Upcoming Events

Advertisement
Advertisements





©2008 Reed Business Information, a division of Reed Elsevier Inc. All rights reserved.
Use of this Web site is subject to its Terms of Use | Privacy Policy
Please visit these other Reed Business sites