2008 KGD Packaging & Test Workshop
Date: Sept. 7-10, 2008
Location: Embassy Suites, Napa, Calif.
The focus for the 2008 workshop is on power electronics. We are currently faced with unprecedented challenges and opportunities in the areas of power engineering, energy efficiency and resource management. Power electronics modules are the solution for challenges in these areas and will be crucial to the industry as we embark on the 21st century. The committee is also seeking presentations that will provide details of emerging technologies for reliability screens, handling, die delivery and packaging die products for use in today's ultraminiature, high-functionality electronic systems. The deadline for submission of proposals is May 23, 2008.
www.napakgd.com
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