Date: July 14-16, 2008

Location: Beaverton, Ore.

The objective of this course is to identify the technical issues in through-hole, SMT, BGA and fine-pitch technology design and manufacturing that must be resolved for an effective implementation of mixed-assembly electronics products. The course material is based on Ray Prasad's textbook Surface Mount Technology: Principles and Practice, 2nd Edition. There are three classes in this one class.

• The first part provides an overview of SMT and advanced packaging technologies.
• Part 2 deals with the details of design for manufacturing, test and repair of SMT, BGA and fine-pitch components.
• The final part provides in-depth details of all the SMT manufacturing processes, including selective soldering, lead-free soldering, inspection, quality control and repair.

www.rayprasad.com/home/rp1/smartlist_10/Upcoming_Courses.html