Semiconductor International NewsBreak
TOP STORY... December 1, 2008

Applied Announces TSV Etcher, In-Fab Mask Inspection Capability
Applied Materials Inc. announced its Silvia deep silicon etcher for creation of the smooth sidewalls required for 3-D interconnects. Also, the company said it is offering a new version of its Aera2 mask inspection tool for use within a fab's lithography cell, rather than at an external mask shop. The Aera2 for lithography system is needed for double patterning, where mask critical dimensions must be closely watched.
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 MORE NEWS...

TEL and Novellus Collaborate on Copper Process Technology

Tokuyama to Build Polycrystalline Silicon Plant in Malaysia

SIA Reports October Chip Sales Decline 2.4% Year-on-Year

Sharp to Build Solar Cell-Based Power Plants in Italy

Nitto Denko Invests in Organic Electronic Device Research in Singapore

China Sunergy Begins Construction of Shanghai Facility

Elpida Uses Immersion Litho for 50 nm DDR3 SDRAM

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Discover a New Dimension in Advanced Process Development
New materials and ever-shrinking geometries compound the challenges of microstructure analysis. Discover a new dimension—3D Atom Probe Microscopy. Sign up for this webcast to learn how 3D atomic-scale analytical imaging is being used to characterize silicides, metal gate stacks and 2D and 3D doping.
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Featured Blog...

Perspectives from the Leading Edge: Highlights of 3-D ASIP Conference
Phil Garrou blogs on the RTI-sponsored 3-D Architectures for Semiconductor Integration and Packaging conference. Mike Shapiro, IBM chief technologist for 3-D development, described technology re-use, while Intel fellow Shekhar Borkar said TSVs could provide a 10× reduction in the power needed to drive I/Os.

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SIA Annual Semiconductor Industry Global Sales Forecast
SIA recently released its annual forecast for global semiconductor sales. Tune in to this on-demand webcast for a discussion and analysis of what may lie ahead for the global chip industry with SIA President George Scalise.
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