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Semiconductor International NewsBreak
TOP STORY... November 18, 2008

3-D Integration Lacking in Design and Test Support
At a symposium yesterday leading up to this week's 3-D Architectures for Semiconductor Integration and Packaging conference, 3-D expert Philip Garrou detailed the rise of the technology as well as the challenges facing it, including test, yield and design.
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MORE NEWS...

2009 Equipment Sales Could Hit Lows Not Seen Since 2003

Mattson Etch to Enter JD for Future Memory Devices

Advanced Fine-Pitch Packaging Development in Singapore

Global Chipmaking Gear Sales Down 40% in September

Tech Layoffs May Have Only Just Begun

MEMC Lowers Q4 Guidance Numbers

BP Solar to Close Manufacturing Plant in Sydney

MORE >>

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FEATURED BLOG...

Hurray for the Do-Gooders!
Senior Editor Alex Braun grudgingly attended this year's Tech Awards, but came away with a sense of the magnitude of what our industry can achieve. "What do these people do that deserves such recognition?" Braun asks, answering his own question: "Everything from creating safe, clean earthquake-resistant houses in China made out of local materials and using local skill, to using photovoltaics (PV) to pump water to irrigate much-needed crops in Africa..."

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