Photomask Printability, Standards and Cleaning Remain Concerns
Alexander E. Braun, Senior Editor — Semiconductor International, 10/10/2008

At the 28th Photomask Technology conference in Monterey, Calif., technologists discussed ways to ensure the printability of patterns at the 22 nm node, and how to avoid damage to fragile features during cleaning. Lithographers reported studies of the printability of 22 nm patterns, the evolution of accurate metrology standards, and how to remove particulates from masks bearing increasingly fragile features. More

Ricmar Group Buys Majority Stake in NanoPhotonics
Staff — Semiconductor International, 10/1/2008

The Ricmar Group (Kramsach, Austria) purchased a majority of NanoPhotonics AG (Mainz, Germany). The plan is to integrate the NanoPhotonics defect inspection metrology tools into Ricmar's wafer handling platform. Ricmar's products include automation, wafer handling, metrology, vacuum coating and dispensing. More

ASML Introduces Faster ArF Scanner, Says EUV on Track for 2010
Laura Peters, Editor-in-Chief — Semiconductor International, 10/20/2008

At a research review meeting in Veldhoven, ASML introduced a new positioning measurement system to improve overlay control by 50% to <2 nm for a Twinscan immersion system. More

ESI, Zygo Agree to Merge
Business Wire, 10/16/2008

Electro Scientific Industries Inc. (ESI) and Zygo Corp. announced that they have entered into a definitive agreement under which the companies will merge in an all-stock transaction. The merger will create a photonics microengineering and metrology systems company. More

KLA-Tencor's PlasmaVolt X2 Measures Plasma Chamber Effects
Business Wire, 10/14/2008

KLA-Tencor introduced the PlasmaVolt X2 for measurement of plasma chamber conditions in wafer processing systems. With an increased number of embedded sensors and improved spatial resolution, the platfrom is highly sensitive to changes in various parameters such as RF power, gas flows, magnetic fields and chamber design. This plasma behavior measurement and characterization system enables enhanced chamber-to-chamber matching, tool qualification, system troubleshooting and process development for production environments. More

SUSS MicroTec Removes Schneidewind as CEO
Staff — Semiconductor International, 10/3/2008

The supervisory board of German equipment vendor SUSS MicroTec removed Stefan Schneidewind as CEO, and immediately placed Christian Schubert on the management board. The board cited "differing views regarding the future strategy of the company." Schubert has held executive positions at several companies, including Kontron, Congatec and Intica Systems. More

Crossing the Semi/Nanotech Bridge
Alexander E. Braun Senior Editor — Semiconductor International, 10/1/2008

Some of the most immediate nanoscale applications, in carbon nanotubes and spintronics, require more cooperation between simulation, modeling and microscopy, as well as all sectors of metrology. An area of concern is the difficulty in doing regular and high-frequency electrical test on a number of these new materials, many of which have an electrical functionality to them. More

Metrology Conference Preparations Are Underway
Alexander E. Braun, Senior Editor — Semiconductor International, 10/21/2008

The second call for papers has gone out for the Frontier of Characterization and Metrology for Nanoelectronics, a conference considered the top metrology event of its kind. The conference will be held at the College of Nanoscale Science and Engineering at the University at Albany, New York, and counts the National Institute of Standards and Technology, the National Science Foundation, the American Vacuum Society and Semiconductor International among its many sponsors. More

Webcast: Metrology Gears for the Nanotech Age
Moderated by Alexander E. Braun, Senior Editor — Semiconductor International, 10/21/2008

Inspection, measurement and test instrumentation are integral to nanotech applications, and advances in the design of nanomaterials and ultimately for manufacturing. However, the resolution, accuracy and capability of many metrology technologies are reaching their limits, and may not meet all the needs of nanotech manufacturing processes. Three experts in the field discuss possible metrology technology options in this webcast, now available on demand. More

SoftJin Rolls Out Mask Defect Analysis Tool

Auto-Leveling Inclinometer

The WaferSense Auto Leveling System 2 (ALS2) Vertical is a MEMS sensor that improves vertical accuracy by 10x. LevelView and LevelReview software provide real-time vertical and horizontal inclination measurements to characterize equipment, conduct statistical analysis via log file data, and establish uniform metrology standards.
Cyber-Optics Semiconductors Inc., Beaverton, Ore.
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Characterization Software

Oct. 27-29, 2008: CMOS Process Integration

Oct. 27-30, 2008: VLSI/ULSI Multilevel Interconnection