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Semiconductor International NewsBreak
TOP STORY... October 15, 2008

Interposers Play a Key Role in 3-D ICs
Participants at the Jisso Forum 2008, held recently near Tokyo, emphasized the important role that interposers will continue to play as 3-D interconnects using through-silicon vias become more prominent. A Renesas study compared package thicknesses of a conventional flip-chip and an interposer-enabled memory-logic 3-D stack.
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SEMI and SolarTech Announce Photovoltaic Partnership

Sanyo to Sharply Increase Solar Module Production in Mexico

Unable to Sell It, Freescale Plans to Close East Kilbride Fab

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Oct. 21 Webcast: Metrology Gears for the Nanotech Age
The resolution, accuracy and capability of many metrology technologies are reaching their limits, and may not meet all the needs of nanotech manufacturing processes. In this webcast, possible metrology technology options will be discussed by experts in the field.
Register now!

FEATURED ARTICLE...

Crossing the Semi/Nanotech Bridge
Some of the most immediate nanoscale applications, in carbon nanotubes and spintronics, take advantage of semiconductor processing's infrastructure, writes Senior Editor Alex Braun in the October issue of Semiconductor International. Many semiconductor companies, including Intel and Samsung, are seriously looking beyond their usual areas of expertise to bio and medical applications.

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