Perspectives From the Leading Edge: Opening the Kimono, Ziptronix Gives Details on DBI Process
Phil Garrou provides more details of the Direct Bond Interconnect (DBI) technology developed at Ziptronix Inc. "Ziptronix has now revealed that in one preferred embodiment the DBI metal is Ni, which can be CMP polished at the same time as the oxide surface without getting any 'cupping' that can happen with some metals like Cu," Garrou writes. "This is obviously a key to the DBI process, i.e. achieving the necessary extremely flat surface so that metal-metal contact occurs when the die (or wafers) are aligned and bonded."